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參數(shù)資料
| 型號： | NCP4331 |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | Synchronous Buck Controller for High Efficiency Post Regulation |
| 中文描述： | 同步降壓控制器的高效率后調(diào)整 |
| 文件頁數(shù)： | 22/23頁 |
| 文件大小： | 195K |
| 代理商： | NCP4331 |
NCP4331
http://onsemi.com
22
PACKAGE DIMENSIONS
TSSOP-16
CASE 948F-01
ISSUE B
SECTION N-N
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MIN
4.90
4.30
---
0.05
0.50
0.65 BSC
0.18
0.09
0.09
0.19
0.19
6.40 BSC
0
MAX
5.10
4.50
1.20
0.15
0.75
MIN
0.193
0.169
---
0.002
0.020
0.026 BSC
0.007
0.004
0.004
0.007
0.007
0.252 BSC
0
MAX
0.200
0.177
0.047
0.006
0.030
INCHES
MILLIMETERS
0.28
0.20
0.16
0.30
0.25
0.011
0.008
0.006
0.012
0.010
8
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE -W-.
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
ééé
ééé
DETAIL E
F
M
L
2X
L/2
-U-
S
U
0.15 (0.006) T
S
U
0.15 (0.006) T
S
U
M
0.10 (0.004)
V
S
T
0.10 (0.004)
-T-
-V-
-W-
0.25 (0.010)
16X REF
N
N
7.06
16X
0.36
16X
1.26
0.65
PITCH
DIMENSIONS: MILLIMETERS
1
SOLDERING FOOTPRINT
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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