參數(shù)資料
型號(hào): MR18R162GEG0-CM8
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: Key Timing Parameters
中文描述: 關(guān)鍵的定時(shí)參數(shù)
文件頁(yè)數(shù): 1/16頁(yè)
文件大?。?/td> 442K
代理商: MR18R162GEG0-CM8
Page 0
MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
Version 1.0 May 2004
Change History
Version 0.1 (December 2003) -
Preliminary
* First copy.
* Based on the 1.0 ver. (July 2002) 256/288Mbit D-die RIMM
Module Datasheet
Version 1.0 (May 2004)
* Eliminate "Preliminary"
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MR18R162GEG0-CM800 制造商:Samsung Semiconductor 功能描述:288MRDRAM_MRDRAM MODULEX18WBGA(LF) - Bulk
MR18R162GEG0-CT9 制造商:SAMSUNG 制造商全稱(chēng):Samsung semiconductor 功能描述:Key Timing Parameters
MR18R326GAG0 制造商:SAMSUNG 制造商全稱(chēng):Samsung semiconductor 功能描述:(32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V
MR18R326GAG0-CM8 制造商:SAMSUNG 制造商全稱(chēng):Samsung semiconductor 功能描述:(32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V
MR18R326GAG0-CT9 制造商:SAMSUNG 制造商全稱(chēng):Samsung semiconductor 功能描述:(32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V