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參數資料
| 型號： | MR18R162GEG0-CK8 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | Key Timing Parameters |
| 中文描述： | 關鍵的定時參數 |
| 文件頁數： | 14/16頁 |
| 文件大?。?/td> | 442K |
| 代理商： | MR18R162GEG0-CK8 |
Page 13
MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
Version 1.0 May 2004
Physical Dimensions -4
( For Heat Spreader )
The following defines the RIMM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate.
The dimensions without tolerance specification use the default tolerance of
±
0.127[
±
0.005].
108.81
±
0.12[4.283
±
0.005]
DIA 2.36
±
0.05[0.09
±
0.001]
12.7
±
0.07[0.5
±
0.002]
12.7
±
0.07[0.5
±
0.002]
WARNING ! HOT SURFACE
http://www.samsungsemi.com
2.9
1.00
±
0.07
[0.04
±
0.002]
WARNING ! HOT SURFACE
http://www.samsungsemi.com
133.35
±
0.127[5.250
±
0.005]
127
±
0.25[5.0
±
0.009]
A
2
2
Center-Point
[0.114]
3
1
A
120.66
±
0.12[4.748
±
0.005]
127
±
0.25[5.0
±
0.009]
Material
CSP
1.27
±
0.10
[0.050
±
0.004]
Thermal
Conductive
Gap Filling
Max 7.80
[0.307]
PCB
Heat Spreader
[
Double side module
]
SECTION A-A
Material
CSP
1.27
±
0.10
[0.050
±
0.004]
Thermal
Conductive
Gap Filling
Max 4.70
[0.185]
PCB
Heat Spreader
[
Single side module
]
SECTION A-A
Figure 6: Heat Spreader Physical Dimensions
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