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參數(shù)資料
| 型號： | MR18R1624EG0-CT9 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | CONN HEADER 20POS DL PCB 30GOLD |
| 中文描述： | 關(guān)鍵的定時參數(shù) |
| 文件頁數(shù)： | 16/16頁 |
| 文件大小： | 442K |
| 代理商： | MR18R1624EG0-CT9 |
Page 15
MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
Version 1.0 May 2004
Table Of Contents
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Key Timing Parameters/Part Numbers . . . . . . . . . . . . . . . . 1
Module Pad Numbers and Signal Names . . . . . . . . . . . . . . 2
Module Connector Pad Description . . . . . . . . . . . . . . . 3 - 4
RIMM Module Functional Diagram . . . . . . . . . . . . . . . . . . 5
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . 6
DC Recommended Electrical Conditions . . . . . . . . . . . . . . 6
RIMM Module Supply Current Profile. . . . . . . . . . . . . . . . 7
AC Electrical Specifications . . . . . . . . . . . . . . . . . . . . . 8 - 9
Physical Dimensions -1, -2 ( For PCB ) . . . . . . . . . . 10 - 11
Physical Dimensions -3, -4 ( For Heat Spreader) . . . 12 - 13
Standard RIMM Module Marking. . . . . . . . . . . . . . . . . . . 14
Copyright May 2004, Samsung Electronics.
All rights reserved.
Direct Rambus, Direct RDRAM and SO-RIMM are trade-
marks of Rambus Inc. Rambus, RDRAM, RIMM and the
Rambus Logo are registered trademarks of Rambus Inc.
This document contains advanced information that is subject
to change by Samsung Electronics without notice
Document Version 1.0
Samsung Electronics Co. Ltd.
San #16 Banwol-ri, Taean-Eup Hwasung-City,
Gyeonggi-Do, KOREA
Telephone: 82-31-208-6369
Fax: 82-31-208-6799
http://www.intl.samsungsemi.com
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MR18R1624GEG0 | Key Timing Parameters |
| MR18R1628EG0-CK8 | Key Timing Parameters |
| MR18R1628EG0-CM8 | Key Timing Parameters |
| MR18R1628EG0-CT9 | Key Timing Parameters |
| MR2835SK | Overvoltage Transient Suppressor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MR18R1624GEG0 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Key Timing Parameters |
| MR18R1628AF0-CK8 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V |
| MR18R1628AF0-CM8 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V |
| MR18R1628AF1-CN9 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V |
| MR18R1628AF1-CT9 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V |
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