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參數(shù)資料
| 型號： | MR16R162GEG0-CM8 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | Key Timing Parameters |
| 中文描述： | 關(guān)鍵的定時參數(shù) |
| 文件頁數(shù)： | 11/16頁 |
| 文件大?。?/td> | 442K |
| 代理商： | MR16R162GEG0-CM8 |
Page 10
MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
Version 1.0 May 2004
Figure 3: 256Mb/288Mb base RIMM Module PCB Physical Dimensions
Physical Dimensions -1
( For PCB )
The following defines the RIMM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate.
The dimensions without tolerance specification use the default tolerance of
±
0.127[
±
0.005].
133.35
±
0.127[5.250
±
0.005]
45.00[1.772]
1.00[0.039]
5.68[0.2236]
11.50[0.453]
45.00[1.772]
78.175[3.078]
55.175
±
0.08[2.172
±
0.003]
7.468[0.294]
4.50[0.177]
A-1
A-92
DETAIL A
DETAIL B
B-1
[0.031
±
0.004]
0.15
±
0.10
[0.006
±
0.004]
[0.12
±
0.002]
DETAIL A
[0.12
±
0.004]
[0.079
±
0.004]
DETAIL B
[0.192]
R 1.00
1.00[0.039]
3.00[0.118]
6.35[0.25]
R 2.00
(A SIDE)
DIA 2.44
120.65[4.75]
(B SIDE)
[0.157
±
0.006]
Note : The gray area above represents the contact surface of the heat spreader.
+
+
Min.6.35[0.25]
Heat spreader
B-92
8.60[0.339]
3
0.80
±
0.10
2.99
±
0.05
3.00
±
0.10
2.00
±
0.10
Min.4.88
COMPONENT AREA
COMPONENT AREA
4.00
±
0.15
2
1
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