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參數(shù)資料
| 型號： | MR16R0824BN1 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | RAMBUS MODULE |
| 中文描述： | Rambus的模塊 |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 37K |
| 代理商： | MR16R0824BN1 |
SERIAL PRESENCE DETECT
MR16R0824(6/8/C/G)BN1
RAMBUS MODULE
- 3 -
Version 1.1 Oct. 2000
39
40
Max. time between Current Control(=t
CCTRL,Max
)
Max. time between Temp. Calibration(=t
TEMP,Max
)
Min. time between Temp. Calibration Enable
and Command(=t
TCEN,Min
)
8
8
ms
ms
100ms
100ms
64h
64h
41
8
t
CYCLE
150t
CYCLE
96h
42
Maximum RAS to Precharge time(=t
RAS-R,Max
)
Maximum time that a Device can stay in Nap
Mode(=t
NLIMIT,Max
)
8
us
64us
40h
43
8
us
10us
0Ah
44
45
46
ACTREFPT[3:0], PCHREFPT[3:0]
CPCHREFPT_DC[3:0], RDREFPT_DC[3:0]
RETREFPT_DC[3:0], WRREFPT_DC[3:0]
Reserved
f
RAS
[11:8]
f
RAS
[7:0]
PMAX,HI, PMAX,LO, Tj
HeatSpreader, thermal sensor, Tplate
PSTBY,HI
PACTI,HI
PACTRW,HI
PSTBY,LO
PACTI,LO
PACTRW,LO
PNAP
PRESA (Reserved for a future thermal parameter)
PRESB (Reserved for a future thermal parameter)
Checksum for bytes 0 ~ 62
Module Manufacturer ID Code
...... Module Manufacturer ID Code
Module Manufacturer Location
Module Part Number(Memory module)
Module Part Number(Module Configuration)
Module Part Number(Data Bits)
...... Module Part Number(Data Bits)
Module Part Number(Feature)
Module Part Number(Module Density)
Module Part Number(Module Density)
...... Module Part Number(Module Density)
Module Part Number
(Refresh, # of banks in comp. & interface)
4,4
4,4
-
4
8
1,1,6
1,1,6
8
8
8
8
8
8
8
-
-
8
8
56
8
8
8
8
8
8
8
8
8
t
CYCLE
t
CYCLE
t
CYCLE
-
MHz
MHz
°
C
°
C
1mA
2mA
8mA
1mA
2mA
8mA
128uA
-
-
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
6t
CYCLE,
6t
CYCLE
5t
CYCLE,
5t
CYCLE
5t
CYCLE,
13t
CYCLE
-
66h
55h
5Dh
00h
01h
65h
24h
9Ch
64h
4Dh
41h
50h
43h
33h
1Fh
00h
00h
20h
CEh
00h
01h
4Dh
52h
31h
36h
52h
20h
30h
38h
47~49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65~71
72
73
74
75
76
77
78
79
80
400MHz
357MHz
300MHz
01h
90h
24h
9Ch
69h
52h
47h
50h
43h
33h
1Fh
01h
2Ch
24h
9Ch
5Ah
46h
38h
50h
43h
33h
1Fh
0,0,100
°
C 0,0,100
°
C 0,0,100
°
C
1,0, 92
°
C
1,0,92
°
C
105mA
100mA
165mA
155mA
575mA
525mA
80mA
80mA
135mA
135mA
410mA
410mA
4.0mA
4.0mA
-
-
-
Samsung
Samsung
Onyang Korea
M
R
1
6
R
Blank
0
8
1,0,92
°
C
90mA
140mA
455mA
80mA
135mA
410mA
4.0mA
86h
99h
3
3
3
3
3
3
3
3
3
3
3
3
81
8
n/a
2
32h
3
82
Module Part Number(# of component )
4d
6d
8d
12d
16d
8
8
8
8
8
8
8
8
8
8
8
8
8
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
4
6
8
C
G
B
N
1
34h
36h
38h
43h
47h
42h
4Eh
31h
2Dh
43h
4Bh
37h
00h
3
3
3
3
3
3
3
3
3
3
3
3
3
83
84
85
86
87
88
89
90
Module Part Number(Component Revision)
Module Part Number(Package Type)
Module Part Number(PCB Revision)
Module Part Number(Hyphen)
Module Part Number(Power)
Module Part Number(t
RAC
& Speed)
Module Part Number(t
RAC
& Speed)
Module Part Number(RFU)
- (Hyphen)
C
K
7
-
C
K
8
C
G
6
43h
4Bh
38h
43h
47h
36h
Byte #
(Dec)
Described Function
Option
Field
Width
Units
Supported Function
K8
K7
Hex Value
K7
Note
G6
K8
G6
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MR16R0824BN1-CG6 | RAMBUS MODULE |
| MR16R0824BN1-CK7 | RAMBUS MODULE |
| MR16R0824BN1-CK8 | RAMBUS MODULE |
| MR16R0826BN1 | RAMBUS MODULE |
| MS-151-C(LP) | Interface RF Connector with Switch |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MR16R0824BN1-CG6 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:RAMBUS MODULE |
| MR16R0824BN1-CK7 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:RAMBUS MODULE |
| MR16R0824BN1-CK8 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:RAMBUS MODULE |
| MR16R0826BN1 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:RAMBUS MODULE |
| MR16R0826BN1-CG6 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:RAMBUS MODULE |
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