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參數(shù)資料
| 型號： | MPN3700G |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | High Voltage Silicon Pin Diodes |
| 中文描述： | 200 V, SILICON, PIN DIODE, TO-92 |
| 封裝： | LEAD FREE, PLASTIC, CASE 182-06, TO-226AC, 2 PIN |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 67K |
| 代理商： | MPN3700G |
MMBV3700LT1, MPN3700
http://onsemi.com
3
PACKAGE DIMENSIONS
SOT23 (TO236)
CASE 31808
ISSUE AN
D
A1
3
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 31801 THRU 07 AND 09 OBSOLETE, NEW
STANDARD 31808.
VIEW C
L
0.25
L1
e
E
E
b
A
SEE VIEW C
DIM
A
A1
b
c
D
E
e
L
L1
H
E
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
MILLIMETERS
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
MAX
H
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
2.10
2.40
2.64
0.083
0.094
0.104
c
mm
inches
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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