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參數(shù)資料
| 型號： | MPC926508SDR2 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 時鐘產(chǎn)生/分配 |
| 英文描述： | 133.33 MHz, OTHER CLOCK GENERATOR, PDSO20 |
| 封裝： | SSOP-20 |
| 文件頁數(shù)： | 5/8頁 |
| 文件大?。?/td> | 129K |
| 代理商： | MPC926508SDR2 |
MPC926508
MOTOROLA
Networking Clock Source
5
PACKAGE DIMENSIONS
DATE 11/20/02
CASE 1467-01
ISSUE O
.337
.150
1
10
11
20
B
PIN 1 ID
4
5
D
.157
.344
4
.236
.118
.010
C
A-B
D
2X 10 TIPS
BB
5
.003
H
A-B
D
2X
A
4
.035
SECTION B-B
R.003 MIN
.0098
.0040
.016
0
8
0
.010
GAUGE PLANE
MIN
8
6
.004 C
.055
SEATING
PLANE
.025
C
20X
18X
.061
.0125
CL
H
3
7
A
(.010)
.012
.010
(.008)
PLATING
BASE METAL
SECTION A-A
.007
.008
M
.007
C A-B D
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
DIMENSIONS ARE IN INCHES.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5m, 1994.
DATUM PLANE H LOCATED AT MOLD PARTING
LINE AND COINCIDENT WITH LEAD, WHERE
LEAD EXITS PLASTIC BODY AT BOTTOM OF
PARTING LINE.
DATUM A, B AND D TO BE DETRMINED WHERE
CENTERLINE BETWEEN LEADS EXITS PLASTIC
BODY AT DATUM PLANE H.
THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH OR PROTRUSIONS, BUT DO INCLUDE
MOLD MISMATCH AND ARE MEASURED AT THE
MOLD PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED .006
INCHES FOR ENDS AND .008 INCHES FOR
SIDES.
THIS DIMENSION IS LENGTH OF TERMINAL FOR
SOLDERING A SUBSTRATE.
FORMED LEADS SHALL BE PLANAR WITH
RESPECT TO ONE ANOTHER WITHIN .004
INCHES AT SEATING PLANE.
THIS DIMENSION IS DEFINED AS THE DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT OF THE PACKAGE BODY.
SD SUFFIX
20-LEAD SSOP PACKAGE
CASE 1461-01
ISSUE O
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