MPC860 PowerQUICC Family Hardware Specifications, Rev. 9
8
Freescale Semiconductor
Thermal Characteristics
Figure 1 shows the undershoot and overshoot voltages at the interface of the MPC860.
Figure 1. Undershoot/Overshoot Voltage for VDDH and VDDL
4
Thermal Characteristics
Table 3. Package Description
Package Designator
Package Code (Case No.)
Package Description
ZP
5050 (1103-01)
PBGA 357 25*25*0.9P1.27
ZQ/VR
5058 (1103D-02)
PBGA 357 25*25*1.2P1.27
GND
GND – 0.3 V
GND – 0.7 V
Not to Exceed 10%
VDDH/VDDL + 20%
VDDH/VDDL
VDDH/VDDL + 5%
of tinterface
1
1. tinterface refers to the clock period associated with the bus clock interface.
VIH
VIL
Note: