參數資料
型號： MPC857TZQ80B
廠商： Freescale Semiconductor
文件頁數： 5/88頁
文件大小： 0K
描述： IC MPU PWRQUICC 80MHZ 357-PBGA
標準包裝： 44
系列： MPC8xx
處理器類型： 32-位 MPC8xx PowerQUICC
速度： 80MHz
電壓： 3.3V
安裝類型： 表面貼裝
封裝/外殼： 357-BBGA
供應商設備封裝： 357-PBGA（25x25）
包裝： 托盤
MPC862/857T/857DSL PowerQUICC Family Hardware Specifications, Rev. 3
Freescale Semiconductor
13
Thermal Calculation and Measurement
7.2
Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (C/W)
RθJC = junction-to-case thermal resistance (C/W)
RθCA = case-to-ambient thermal resistance (C/W)
RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to
affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the
thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful
for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink
to the ambient environment. For most packages, a better model is required.
7.3
Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two
resistor model consisting of a junction-to-board and a junction-to-case thermal resistance. The
junction-to-case covers the situation where a heat sink is used or where a substantial amount of heat is
dissipated from the top of the package. The junction-to-board thermal resistance describes the thermal
performance when most of the heat is conducted to the printed circuit board. It has been observed that the
thermal performance of most plastic packages and especially PBGA packages is strongly dependent on the
board temperature; see Figure 3.
Figure 3. Effect of Board Temperature Rise on Thermal Behavior
0
10
20
30
40
50
60
70
80
90
100
020
40
60
80
Board Temperture Rise Above Ambient Divided by Package
Power
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