參數(shù)資料
型號(hào)： MPC8560PXAQFC
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 7/108頁(yè)
文件大小： 0K
描述： MPU POWERQUICC III 783FCPBGA
標(biāo)準(zhǔn)包裝： 36
系列： MPC85xx
處理器類型： 32-位 MPC85xx PowerQUICC III
速度： 1.0GHz
電壓： 1.3V
安裝類型： 表面貼裝
封裝/外殼： 784-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 783-FCPBGA（29x29）
包裝： 托盤
MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
104
Freescale Semiconductor
Device Nomenclature
19 Device Nomenclature
Ordering information for the parts fully covered by this specification document is provided in
19.1 Part Numbers Fully Addressed by this Document
Table 63 provides the Freescale part numbering nomenclature for the MPC8560. Note that the individual
part numbers correspond to a maximum processor core frequency. For available frequencies, contact your
local Freescale sales office. In addition to the processor frequency, the part numbering scheme also
includes an application modifier which may specify special application conditions. Each part number also
contains a revision code which refers to the die mask revision number.
Table 63. Part Numbering Nomenclature
MPC
nnnn
t
pp
ff(f)
c
r
Product
Code
Part
Identifier
Temperature
Range 1
Package 2
Processor
Frequency 3, 4
Platform
Frequency
Revision Level
MPC
8560
Blank = 0 to 105
°C
C= -40 to 105
°C
PX = FC-PBGA
VT = FC-PBGA
(Pb-free)
833 = 833 MHz
667 = 667 MHz
L = 333 MHz
J= 266 MHz
B = Rev. 2.0
(SVR = 0x80700020)
C = Rev. 2.1
(SVR = 0x80700021)
MPC
8560
Blank = 0 to 105
°C
C = –40 to 105
°C
PX = FC-PBGA
VT = FC-PBGA
(Pb-free)
AQ = 1.0 GHz
F = 333 MHz
B = Rev. 2.0
(SVR = 0x80700020)
C = Rev. 2.1
(SVR = 0x80700021)
Notes:
1.For Temperature Range=C, Processor Frequency is limited to 667 MHz.
2.See Section 14, “Package and Pin Listings” for more information on available package types.
3.Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. The core must be clocked at a minimum frequency of 400 MHz. A device
must not be used beyond the core frequency or platform frequency indicated on the device.
4. Designers should use the maximum power value corresponding to the core and platform frequency grades indicated on
the device. A lower maximum power value should not be assumed for design purposes even when running at a lower
frequency.
相關(guān)PDF資料
PDF描述
MPC8568EPXAQGG MPU POWERQUICC III 1023-PBGA
MPC8572ECVTAVND MPU POWERQUICC III 1023FCPBGA
MPC860SRZQ66D4R2 IC MPU PWRQUICC 66MHZ 357-PBGA
MPC862TZQ80B IC MPU PWRQUICC 80MHZ 357-PBGA
MSC7112VM800 IC DSP PROCESSOR 16BIT 400MAPBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8560VT667LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT667LC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT833LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT833LC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VTAQFB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*