參數(shù)資料
型號(hào): MPC8541VTAJD
廠商: Freescale Semiconductor
文件頁數(shù): 22/88頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC III 783-FCPBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 533MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
配用: CWH-PPC-8540N-VE-ND - KIT EVAL SYSTEM MPC8540
MPC8541E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
Freescale Semiconductor
29
Ethernet: Three-Speed, MII Management
8.2.5
RGMII and RTBI AC Timing Specifications
Table 26 presents the RGMII and RTBI AC timing specifications.
Table 26. RGMII and RTBI AC Timing Specifications
At recommended operating conditions with LVDD of 2.5 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
Data to clock output skew (at transmitter)
tSKRGT
5
–500
0
500
ps
Data to clock input skew (at receiver) 2
tSKRGT
1.0
2.8
ns
Clock cycle duration 3
tRGT
6
7.2
8.0
8.8
ns
Duty cycle for 1000Base-T 4
tRGTH/tRGT
6
45
50
55
%
Duty cycle for 10BASE-T and 100BASE-TX 3
tRGTH/tRGT
6
40
50
60
%
Rise and fall times
tRGTR
6,7
, tRGTF
6,7
0.75
ns
Notes:
1. Note that, in general, the clock reference symbol representation for this section is based on the symbols RGT to represent
RGMII and RTBI timing. For example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Note also that the
notation for rise (R) and fall (F) times follows the clock symbol that is being represented. For symbols representing skews,
the subscript is skew (SK) followed by the clock that is being skewed (RGT).
2. The RGMII specification requires that PC board designer add 1.5 ns or greater in trace delay to the RX_CLK in order to
meet this specification. However, as stated above, this device functions with only 1.0 ns of delay.
3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as
long as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed
transitioned between.
5. Guaranteed by characterization.
6. Guaranteed by design.
7. Signal timings are measured at 0.5 and 2.0 V voltage levels.
相關(guān)PDF資料
PDF描述
AMC65DRTH-S734 CONN EDGECARD 130PS DIP .100 SLD
AMC65DREN-S734 CONN EDGECARD 130PS .100 EYELET
AMC65DREH-S734 CONN EDGECARD 130PS .100 EYELET
AYF532435 CONN SOCKET FPC 0.5MM 24POS SMD
ABB95DHBT CONN EDGECARD 190PS R/A .050 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8541VTALF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541VTAPF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541VTAQF 功能描述:IC MPU POWERQUICC III 783-FCPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC85xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤
MPC8543ECHXAQG 功能描述:微處理器 - MPU PQ38 8548E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8543ECPXAQGB 功能描述:微處理器 - MPU FG PQ38 8548 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324