參數(shù)資料
型號： MPC8533VTARJA
廠商： Freescale Semiconductor
文件頁數(shù)： 109/112頁
文件大?。?/td> 0K
描述： MPU POWERQUICC 783-PBGA
標準包裝： 36
系列： MPC85xx
處理器類型： 32-位 MPC85xx PowerQUICC III
速度： 1.067GHz
電壓： 0.95 V ~ 1.05 V
安裝類型： 表面貼裝
封裝/外殼： 783-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 783-FCPBGA（29x29）
包裝： 托盤
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
96
Freescale Semiconductor
Thermal
Figure 58 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 58. Package with Heat Sink Mounted to a Printed-Circuit Board
The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is
conducted through the silicon and through the heat sink attach material (or thermal interface material), and
finally to the heat sink. The junction-to-case thermal resistance is low enough that the heat sink attach
material and heat sink thermal resistance are the dominant terms.
20.3.2
Thermal Interface Materials
A thermal interface material is required at the package-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 59 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance. The bare joint results in a
thermal resistance approximately six times greater than the thermal grease joint.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
相關(guān)PDF資料
PDF描述
IDT70V06S15PF8 IC SRAM 128KBIT 15NS 64TQFP
IDT7035S15PF8 IC SRAM 144KBIT 15NS 100TQFP
IDT7025S17PF8 IC SRAM 128KBIT 17NS 100TQFP
MPC8544VTANGA IC MPU POWERQUICC III 783-FCBGA
IDT7025S15PF8 IC SRAM 128KBIT 15NS 100TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8535AVTAKG 功能描述:微處理器 - MPU 8535 COMMERCIAL 600 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8535AVTAKGA 功能描述:微處理器 - MPU 8535 Non E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8535AVTANG 功能描述:微處理器 - MPU 8535 COMMERCIAL 800 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8535AVTANGA 功能描述:微處理器 - MPU 8535 Non E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8535AVTAQG 功能描述:微處理器 - MPU 8535 COMMERCIAL 1000 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*