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      參數資料
      型號: MPC8379EVRAJF
      廠商: Freescale Semiconductor
      文件頁數: 26/127頁
      文件大?。?/td> 0K
      描述: MPU PWRQUICC II 533MHZ 689TEPBGA
      標準包裝: 27
      系列: MPC83xx
      處理器類型: 32-位 MPC83xx PowerQUICC II Pro
      速度: 533MHz
      電壓: 1V
      安裝類型: 表面貼裝
      封裝/外殼: 689-BBGA 裸露焊盤
      供應商設備封裝: 689-TEPBGA II(31x31)
      包裝: 托盤
      配用: MPC8377E-RDBA-ND - BOARD REF DES MPC8377 REV 2.1
      MPC8377E-MDS-PB-ND - BOARD MODULAR DEV SYSTEM
      MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
      Freescale Semiconductor
      121
      These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
      capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
      In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
      feeding the VDD, OVDD, GVDD, and LVDD planes, to enable quick recharging of the smaller chip
      capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the
      quick response time necessary. They should also be connected to the power and ground planes through two
      vias to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS tantalum or Sanyo
      OSCON).
      25.3
      Connection Recommendations
      To ensure reliable operation, it is highly recommended that unused inputs be connected to an appropriate
      signal level. Unused active low inputs should be tied to OVDD, GVDD, or LVDD as required. Unused
      active high inputs should be connected to GND. All NC (no-connect) signals must remain unconnected.
      Power and ground connections must be made to all external VDD, GVDD, LVDD, OVDD, and GND pins
      of the device.
      25.4
      Output Buffer DC Impedance
      The device drivers are characterized over process, voltage, and temperature. For all buses, the driver is a
      push-pull single-ended driver type (open drain for I2C).
      To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
      or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 66). The
      output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
      When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
      OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
      other in value. Then, Z0 = (RP + RN)/2.
      Figure 66. Driver Impedance Measurement
      OVDD
      OGND
      RP
      RN
      Pad
      Data
      SW1
      SW2
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      參數描述
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