參數(shù)資料
型號: MPC8360CVVAJDGA
廠商: Freescale Semiconductor
文件頁數(shù): 102/102頁
文件大小: 0K
描述: IC MPU POWERQUICC II PRO 740TBGA
標準包裝: 21
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 533MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 740-LBGA
供應商設備封裝: 740-TBGA(37.5x37.5)
包裝: 托盤
配用: MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
99
Pull-Up Resistor Requirements
23.7
Pull-Up Resistor Requirements
The device requires high resistance pull-up resistors (10 k
Ωis recommended) on open drain type pins including I2C pins,
Ethernet Management MDIO pin, and EPIC interrupt pins.
For more information on required pull-up resistors and the connections required for the JTAG interface, see
MPC8360E/MPC8358E PowerQUICC Design Checklist (AN3097).
24
Ordering Information
24.1
Part Numbers Fully Addressed by this Document
This table provides the Freescale part numbering nomenclature for the MPC8360E/58E. Note that the individual part numbers
correspond to a maximum processor core frequency. For available frequencies, contact your local Freescale sales office.
Additionally to the processor frequency, the part numbering scheme also includes an application modifier, which may specify
special application conditions. Each part number also contains a revision code that refers to the die mask revision number.
This table shows the SVR settings by device and package type.
Table 80. Part Numbering Nomenclature1
MPC nnnn
e
t
pp
aa
a
A
Product
Code
Part
Identifier
Encryption
Acceleration
Temperature
Range
Package2
Processor
Frequency3
Platform
Frequency
QUICC
Engine
Frequency
Die
Revision
MPC
8358
Blank = not
included
E = included
Blank = 0
° C
TA to 105° C
TJ
C= –40
° C TA
to 105
° C TJ
ZU = TBGA
VV = TBGA
(no lead)
e300 core speed
AD = 266 MHz
AG = 400 MHz
D = 266 MHz
E = 300 MHz
G = 400 MHz
A = rev. 2.1
silicon
8360
e300 core speed
AG = 400 MHz
AJ = 533 MHz
AL = 667 MHz
D = 266 MHz
F = 333 MHz
G = 400 MHz
H = 500 MHz
A = rev. 2.1
silicon
MPC
(rev. 2.0
silicon
only)
8360
Blank = not
included
E = included
0
° C TA to
70
° C TJ
ZU = TBGA
VV = TBGA
(no lead)
e300 core speed
AH = 500 MHz
AL = 667 MHz
F = 333 MHz
G = 400 MHz
H = 500 MHz
Notes:
1. Not all processor, platform, and QUICC Engine block frequency combinations are supported. For available frequency
combinations, contact your local Freescale sales office or authorized distributor.
2. See Section 20, “Package and Pin Listings,for more information on available package types.
3. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by part number specifications may support other
maximum core frequencies.
Table 81. SVR Settings
Device
Package
SVR
(Rev. 2.0)
SVR
(Rev. 2.1)
MPC8360E
TBGA
0x8048_0020
0x8048_0021
MPC8360
TBGA
0x8049_0020
0x8049_0021
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相關代理商/技術參數(shù)
參數(shù)描述
MPC8360CVVAJDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360CVVAJFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360CVVAJFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360CVVALDGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360CVVALDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications