參數(shù)資料
型號: MPC8347CZQADDA
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
封裝: 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-620
文件頁數(shù): 12/120頁
文件大?。?/td> 1349K
代理商: MPC8347CZQADDA
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
109
Thermal
20.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimize the size of the clearance to minimize the change in thermal
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental
difficulties with this technique, many engineers measure the heat sink temperature and then back calculate
the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction to case thermal resistance.
TJ = TC + (RθJC × PD)
where:
TJ = junction temperature (°C)
TC = case temperature of the package (°C)
RθJC = junction to case thermal resistance (°C/W)
PD = power dissipation (W)
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