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參數(shù)資料
| 型號(hào)： | MPC8255CZUHFBXXX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA480 |
| 封裝： | 37.50 X 37.50 MM, 1.27 MM PITCH, TBGA-480 |
| 文件頁數(shù)： | 2/40頁 |
| 文件大小： | 1069K |
| 代理商： | MPC8255CZUHFBXXX |
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MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 1.3
10
Freescale Semiconductor
Electrical and Thermal Characteristics
2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θ
JA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and
TJ is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD
2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving equations (1) and (2) iteratively for any value of TA.
3
Rev C.2 silicon only.
Table 4. Thermal Characteristics
Characteristics
Symbol
Value
Unit
Air Flow
Thermal resistance for TBGA
θ
JA
13.07 1
1
Assumes a single layer board with no thermal vias
°C/W
NC 2
2
Natural convection
θ
JA
9.551
°C/W
1 m/s
θ
JA
10.48 3
3
Assumes a four layer board
°C/W
NC
θ
JA
7.783
°C/W
1 m/s
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