參數(shù)資料
型號(hào)： MPC8245LZU333D
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 48/68頁(yè)
文件大?。?/td> 0K
描述： IC MPU 32BIT 333MHZ 352-TBGA
標(biāo)準(zhǔn)包裝： 24
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 333MHz
電壓： 2V
安裝類型： 表面貼裝
封裝/外殼： 352-LBGA
供應(yīng)商設(shè)備封裝： 352-TBGA（35x35）
包裝： 托盤
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
52
Freescale Semiconductor
System Design
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Selection of an appropriate heat sink depends on thermal performance at a given air velocity, spatial
volume, mass, attachment method, assembly, and cost. Other heat sinks offered by Aavid Thermalloy,
Alpha Novatech, IERC, Chip Coolers, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances and may or may not need airflow.
7.8.1
Internal Package Conduction Resistance
The intrinsic conduction thermal resistance paths for the TBGA cavity-down packaging technology shown
in Figure 29 are as follows:
Die junction-to-case thermal resistance
Die junction-to-ball thermal resistance
Figure 29 depicts the primary heat transfer path for a package with an attached heat sink mounted on a
printed-circuit board.
Figure 29. TBGA Package with Heat Sink Mounted to a Printed-Circuit Board
In a TBGA package, the active side of the die faces the printed-circuit board. Most of the heat travels
through the die, across the die attach layer, and into the copper spreader. Some of the heat is removed from
printed-circuit board through the solder balls. The heat is then removed from the exposed surfaces of the
board through convection and radiation. If a heat sink is used, a larger percentage of heat leaves through
the top side of the spreader.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance)
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