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| 型號(hào)： | MPC8245ARVV400D |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 50/68頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU 32BIT 400MHZ 352-TBGA |
| 標(biāo)準(zhǔn)包裝： | 24 |
| 系列： | MPC82xx |
| 處理器類型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 400MHz |
| 電壓： | 2.1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 352-LBGA |
| 供應(yīng)商設(shè)備封裝： | 352-TBGA（35x35） |
| 包裝： | 托盤 |
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MPC8245 Integrated Processor Hardware Specifications, Rev. 10
54
Freescale Semiconductor
System Design
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
7.8.3
Heat Sink Usage
An estimation of the chip junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where
TA = ambient temperature for the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, two values are in common usage: the value determined
on a single-layer board and the value obtained on a board with two planes. Which value is closer to the
application depends on the power dissipated by other components on the board. The value obtained on a
single-layer board is appropriate for the tightly packed printed-circuit board. The value obtained on the
board with the internal planes is usually appropriate if the board has low power dissipation and the
components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
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| MPC8245ARZU400D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8245ARZU400D | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-352 |
| MPC8245ARZU466D | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Part Number Specification for the MPC8245ARZUnnnX Series |
| MPC8245EC | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8245 Integrated Processor Hardware Specifications |
| MPC8245ECS02AD | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8245 Integrated Processor Hardware Specifications |
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