參數(shù)資料
型號(hào): MPC8241TVR166D
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 46/58頁(yè)
文件大小: 0K
描述: IC MPU 32BIT 166MHZ 357-PBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC82xx
處理器類(lèi)型: 32-位 MPC82xx PowerQUICC II
速度: 166MHz
電壓: 1.8V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 357-BBGA
供應(yīng)商設(shè)備封裝: 357-PBGA(25x25)
包裝: 托盤(pán)
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
50
Freescale Semiconductor
System Design Information
Figure 31. Thermal Performance of Select Thermal Interface Material
The board designer can choose among several types of thermal interface. Heat sink adhesive materials are
selected on the basis of high conductivity and adequate mechanical strength to meet equipment
shock/vibration requirements. Several commercially-available thermal interfaces and adhesive materials
are provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
0
0.5
1
1.5
2
0
1020304050607080
Silicone Sheet (0.006 in.)
Bare Joint
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Sp
eci
fi
c
Ther
m
a
l
Res
is
tan
ce
(
K
-i
n
.2
/W
)
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