- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371134 > MPC8240EC (Motorola, Inc.) Integrated Processor Hardware Specifications PDF資料下載
參數(shù)資料
| 型號： | MPC8240EC |
| 廠商： | Motorola, Inc. |
| 英文描述： | Integrated Processor Hardware Specifications |
| 中文描述： | 綜合處理器硬件規(guī)格 |
| 文件頁數(shù)： | 40/52頁 |
| 文件大?。?/td> | 1027K |
| 代理商： | MPC8240EC |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁當前第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁
40
MPC8240 Integrated Processor Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
System Design Information
voltage, the MPC8240 always performs 3.3-V signaling as described in the
PCI Local Bus Specification,
(Rev 2.1). The MPC8240 only tolerates 5-V signals when interfaced into a 5-V PCI bus system.
1.7.8
Thermal Management Information
This section provides thermal management information for the tape ball grid array (TBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods: adhesive, spring clip to holes in the printed-circuit
board, or package and mounting clip and screw assembly. See Figure 26.
Figure 26. Package Exploded Cross-Sectional View with Several Heat Sink Options
Figure 27 depicts the die junction-to-ambient thermal resistance for four typical cases:
A heat sink is not attached to the TBGA package, and there exists high board-level thermal loading
of adjacent components.
A heat sink is not attached to the TBGA package, and there exists low board-level thermal loading
of adjacent components.
A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA package, and there
exists high board-level thermal loading of adjacent components.
A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA package, and there
exists low board-level thermal loading of adjacent components.
Adhesive or
Thermal Interface
Heat Sink
TBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
F
Freescale Semiconductor, Inc.
n
.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8240 | 32-Bit Microprocessor(32位微處理器) |
| MPC8260ACZU | MPC826xA (HiP4) Family Hardware Specifications |
| MPC8260CZU | MPC826xA (HiP4) Family Hardware Specifications |
| MPC8264ACZU | MPC826xA (HiP4) Family Hardware Specifications |
| MPC8264AZU | MPC826xA (HiP4) Family Hardware Specifications |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8241 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Intergrated Processor Hardware Specifications |
| MPC8241EC | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8241 Integrated Processor Hardware Specifications |
| MPC8241LVR166D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8241LVR200D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8241LVR266D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。