
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
11
Electrical and Thermal Characteristics
Table 6
provides the DC electrical characteristics for the MPC755.
Table 5. Thermal Sensor Specifications
At recommended operating conditions (see
Table 3
)
Characteristic
Min
Max
Unit
Notes
Temperature range
0
127
°C
1
Comparator settling time
20
—
μs
2, 3
Resolution
4
—
°C
3
Accuracy
–12
+12
°C
3
Notes:
1. The temperature is the junction temperature of the die. The thermal assist unit’s raw output does not indicate an absolute temperature, but
must be interpreted by software to derive the absolute junction temperature. For information about the use and calibration of the TAU, see
Freescale Application Note AN1800/D,
Programming the Thermal Assist Unit in the MPC750 Microprocessor.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3 SPR.
3. Guaranteed by design and characterization.
Table 6. DC Electrical Specifications
At recommended operating conditions (see
Table 3
)
Characteristic
Nominal
Bus Voltage
1
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except SYSCLK)
2.5
V
IH
1.6
(L2)OV
DD
+ 0.3
V
2, 3
3.3
V
IH
2.0
(L2)OV
DD
+ 0.3
V
2, 3
Input low voltage (all inputs except SYSCLK)
2.5
V
IL
–0.3
0.6
V
2
3.3
V
IL
–0.3
0.8
V
SYSCLK input high voltage
2.5
KV
IH
1.8
OV
DD
+ 0.3
V
3.3
KV
IH
2.4
OV
DD
+ 0.3
V
SYSCLK input low voltage
2.5
KV
IL
–0.3
0.4
V
3.3
KV
IL
–0.3
0.4
V
Input leakage current,
V
in
= L2OV
DD
/OV
DD
I
in
—
10
μA
2, 3
High-Z (off-state) leakage current,
V
in
= L2OV
DD
/OV
DD
I
TSI
—
10
μA
2, 3, 5
Output high voltage, I
OH
=
–6
mA
2.5
V
OH
1.7
—
V
3.3
V
OH
2.4
—
V
Output low voltage, I
OL
=
6
mA
2.5
V
OL
—
0.45
V
3.3
V
OL
—
0.4
V