參數資料
型號: MPC745BVT350
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255
封裝: 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-255
文件頁數: 40/56頁
文件大?。?/td> 1521K
代理商: MPC745BVT350
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
45
System Design Information
The board designer can choose between several types of heat sinks to place on the MPC755. There are
several commercially-available heat sinks for the MPC755 provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
8.8.1
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 4, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (or top-of-die for exposed silicon) thermal resistance
The die junction-to-ball thermal resistance
Figure 26 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Heat generated on the active side of the chip is conducted through the silicon, then through the heat sink
attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Since the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the
silicon may be neglected. Thus, the heat sink attach material and the heat sink conduction/convective
thermal resistances are the dominant terms.
相關PDF資料
PDF描述
MPC755CRX400 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC745BPX300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC755CVT400 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
MPC755BPX350 32-BIT, 350 MHz, RISC PROCESSOR, PBGA360
MPC755CRX400LE 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
相關代理商/技術參數
參數描述
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MPC745CPX350LE 功能描述:微處理器 - MPU GF REV 2.8 105C 6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC745CPX350LE 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 350MHZ 255-FCPBGA
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MPC75 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors