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參數(shù)資料
| 型號： | MPC740PRX366LE |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 366 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 10/24頁 |
| 文件大?。?/td> | 543K |
| 代理商： | MPC740PRX366LE |
18
XPC750P RISC Microprocessor Hardware Specications
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
Package Description
Maximum module height
3.00 mm
Ball diameter
0.89 mm (35 mil)
1.7.2 Mechanical Dimensions of the XPC740P
Figure 9. provides the mechanical dimensions and bottom surface nomenclature of the XPC740P, 255
CBGA package.
Figure 9. Mechanical Dimensions and Bottom Surface Nomenclature of the XPC740P
1.7.3 Parameters for the XPC750P
The package parameters are as provided in the following list. The package type is 25 x 25 mm, 360-lead
ceramic ball grid array (CBGA).
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A METALIZED
FEATURE WITH VARIOUS SHAPES. BOTTOM
SIDE A1 CORNER IS DESIGNATED WITH A BALL
MISSING FROM THE ARRAY.
0.2
B
C
255X
D
2X
A1 CORNER
E
e
E1
D1
0.2
2X
B
A
123456789 10 11 12 13 14 15 16
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
e/2
A
0.3
C
0.15
b
e/2
A
A1
A2
C
0.15 C
M
Millimeters
DIM
Min
Max
A
2.45
3.00
A1
0.79
0.99
A2
0.9
1.10
b
0.82
0.93
D
21.00 BSC
D1
8.3
8.5
e
1.27 BSC
E
21.00 BSC
E1
9.0
9.2
M
2.00
F
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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