參數(shù)資料
型號(hào)： MPC5553EVBGHS
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 56/68頁(yè)
文件大?。?/td> 0K
描述： KIT EVAL GREEN HILLS SOFTWARE
標(biāo)準(zhǔn)包裝： 1
類(lèi)型： 微控制器
適用于相關(guān)產(chǎn)品： MPC5553
所含物品： 評(píng)估板和演示軟件
相關(guān)產(chǎn)品： MPC5553MZQ132-ND - IC MCU MPC5553 REV A 324-PBGA
MPC5553MZP132-ND - IC MCU MPC5553 REV A 416-PBGA
MPC5553 Microcontroller Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor
6
3.2
Thermal Characteristics
The shaded rows in the following table indicate information specific to a four-layer board.
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TA = ambient temperature for the package (oC)
RJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Table 3. MPC5553 Thermal Characteristics
Spec
MPC5553 Thermal Characteristic
Symbol
Packages
Unit
208
MAPBGA
324
PBGA
416
PBGA
1
Junction to ambient, natural convection (one-layer board) 1, 2
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
RJA
41
30
29
°C/W
2
Junction to ambient, natural convection 1, 3
(four-layer board 2s2p)
3 Per JEDEC JESD51-6 with the board horizontal.
RJA
25
21
°C/W
3
Junction to ambient (@200 ft./min., one-layer board)
RJMA
33
24
23
°C/W
4
Junction to ambient (@200 ft./min., four-layer board 2s2p)
RJMA
22
17
18
°C/W
5
Junction to board (four-layer board 2s2p) 4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RJB
15
12
13
°C/W
6
Junction to case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RJC
78
9
°C/W
7
Junction to package top, natural convection 6
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
JT
22
2
°C/W
相關(guān)PDF資料
PDF描述
MPC5553EVB KIT EVAL MPC5553MZP132
MAX6440UTLSTD7+T IC BATTERY MON SNGL SOT23-6
GBC15DRYS-S734 CONN EDGECARD 30POS DIP .100 SLD
MPC5534EVBISYS KIT EVAL ISYSTEMS MPC5534
V300C36E75BL2 CONVERTER MOD DC/DC 36V 75W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC5553EVBISYS 功能描述:開(kāi)發(fā)軟件 ISYSTEMS CONTENT Qorivva RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors
MPC5553MVF112 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5553MVF112R2 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5553MVF132 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5553MVF132R2 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Microcontroller
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*