When powering down, V
參數(shù)資料
型號(hào)： MPC5553EVBE
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 4/68頁(yè)
文件大?。?/td> 0K
描述： BOARD EVAL FOR MPC5553
產(chǎn)品培訓(xùn)模塊： MPC55xx PitchPak Family
標(biāo)準(zhǔn)包裝： 1
類(lèi)型： MCU
適用于相關(guān)產(chǎn)品： MPC5553
所含物品： 評(píng)估板和演示軟件
配用： MFR4310FRDC-ND - FRDC FLEXRAY DAUGHTER CARD
相關(guān)產(chǎn)品： MPC5553MZQ132-ND - IC MCU MPC5553 REV A 324-PBGA
MPC5553MZP132-ND - IC MCU MPC5553 REV A 416-PBGA
MPC5553 Microcontroller Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor
12
When powering down, VRC33 and VDDSYN have no delta requirement to each other, because the bypass
capacitors internal and external to the device are already charged. When not powering up or down, no delta
between VRC33 and VDDSYN is required for the VRC to operate within specification.
There are no power up/down sequencing requirements to prevent issues such as latch-up, excessive current
spikes, and so on. Therefore, the state of the I/O pins during power up and power down varies depending
on which supplies are powered.
Table 7 gives the pin state for the sequence cases for all pins with pad type pad_fc (fast type).
Table 8 gives the pin state for the sequence cases for all pins with pad type pad_mh (medium type) and
pad_sh (slow type).
The values in Table 7 and Table 8 do not include the effect of the weak-pull devices on the output pins
during power up.
Before exiting the internal POR state, the voltage on the pins go to a high-impedance state until POR
negates. When the internal POR negates, the functional state of the signal during reset applies and the
weak-pull devices
(up or down) are enabled as defined in the device reference manual. If VDD is too low to correctly
propagate the logic signals, the weak-pull devices can pull the signals to VDDE and VDDEH.
To avoid this condition, minimize the ramp time of the VDD supply to a time period less than the time
required to enable the external circuitry connected to the device outputs.
During initial power ramp-up, when Vstby is 0.6v or above. a typical current of 1-3mA and maximum of
4mA may be seen until VDD is applied. This current will not reoccur until Vstby is lowered below Vstby
min. specification.
Table 7. Pin Status for Fast Pads During the Power Sequence
VDDE
VDD33
VDD
POR
Pin Status for Fast Pad Output Driver
pad_fc (fast)
Low
—
Asserted
Low
VDDE
Low
Asserted
High
VDDE
Low
VDD
Asserted
High
VDDE
VDD33
Low
Asserted
High impedance (Hi-Z)
VDDE
VDD33
VDD
Asserted
Hi-Z
VDDE
VDD33
VDD
Negated
Functional
Table 8. Pin Status for Medium and Slow Pads During the Power Sequence
VDDEH
VDD
POR
Pin Status for Medium and Slow Pad Output Driver
pad_mh (medium) pad_sh (slow)
Low
—
Asserted
Low
VDDEH
Low
Asserted
High impedance (Hi-Z)
VDDEH
VDD
Asserted
Hi-Z
VDDEH
VDD
Negated
Functional
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