參數(shù)資料
型號(hào)： MP1T
廠商： Mitel Networks Corporation
英文描述： Quadrature Downconverter
中文描述： 正交下變頻器
文件頁(yè)數(shù)： 17/20頁(yè)
文件大?。?/td> 566K
代理商： MP1T
17
SL1711
ABSOLUTE MAXIMUM RATINGS
All voltages are reffered to Vee at 0V
Characteristics
Min
Max
Units
Conditions
Supply voltage, Vcc
-0.3
7
V
IFFIN &IFINB input voltage
2.5
Vp-p
IFIN & IFINB input DC offset
-0.3
Vcc+0.3
V
IOUT & QOUT DC offset
-0.3
Vcc+0.3
V
AGC DC offset
-0.3
Vcc+0.3
V
VCO1 & 2 DC offset
-0.3
Vcc+0.3
V
VCODDIS DC offset
-0.3
Vcc+0.3
V
PSCAL & PSCALB DC offset
-0.3
Vcc+0.3
Storage temperature
-55
125
°
C
Junction temperature
150
°
C
PSOP16 package thermal
TBA
°
C/W
resistance, chip to ambient
PSOP16 package thermal
TBA
°
C/W
resitance, chip to case
MP16 package thermal resistance
81
°
C/W
chip to Ambient
MP16 package thermal resistance
28
°
C/W
chip to case
Power consumption at 5.25V
657
mW
ESD protection
2
kV
Mil std 883B method 3015 cat 1
ADDITIONAL INFORMATION REGARDING THE PSOP PACKAGE.
The following information should be noted when using the PSOP package fitted to the SL1711.
(a)
This package uses the standard SOIC 16 footprint.
(b)
There is no need to make a thermal connection between the package and the board. If such a connection is made using
a thermal adhesive this will enhance the long term reliability of the product by reducing the junction temperature.
(c)
The heatsink that is evident on the base of the package is solderable.
(d)
There is no direct electrical connection between any of the device pins and the metal heatsinkslug. However if the
heatsink is to be electrically connected to the PCB these connections should be confined to the ground plane.
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