- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383628 > MP02X130-20 (Dynex Semiconductor Ltd.) MB 32C 32#20 PIN RECP PDF資料下載
參數(shù)資料
| 型號： | MP02X130-20 |
| 廠商： | Dynex Semiconductor Ltd. |
| 英文描述： | MB 32C 32#20 PIN RECP |
| 中文描述： | 相位控制雙可控硅，SCR /二極管模塊 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 127K |
| 代理商： | MP02X130-20 |
7/8
www.dynexsemi.com
MP02X130 Series
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
23
23
24
13
80
3
3
94
3x M6
1
2 holes
6.5
1
2
3
2
5
15
K
2
G
2
K
1
G
1
Nominal weight: 350g
Recommended fixings for mounting: M6 socket head cap screws
Recommended mounting torque: 6Nm (55lb.ins)
Recommended torque for electrical connections: 5Nm (44lb.ins)
Maximum torque for electrical connections: 8Nm (70lb.ins)
Module outline type code: MP02
1
2
3
K
2
G
2
G
1
K
1
1
2
3
Circuit type: HBN
Circuit type: HBT
Circuit type: HBP
G
1
K
1
1
2
3
K
2
G
2
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75
C if full rated current is to be achieved. Power
dissipation may be calculated by use of V
T(TO)
and r
T
information
in accordance with standard formulae. We can provide
assistance with calculations or choice of heatsink if required.
The heatsink surface must be smooth and flat; a surface finish
of N6 (32
μ
in) and a flatness within 0.05mm (0.002") are
recommended.
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild chemical
etchant and then cleaned with a solvent to remove oxide build
up and foreign material. Care should be taken to ensure no
foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to ensure
optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or
‘
T
’
slots) in the heatsink.
Fit and finger tighten the recommended fixing bolts at each end.
Using a torque wrench, continue to tighten the fixing bolts by
rotating each bolt in turn no more than 1/4 of a revolution at a
time, until the required torque of 6Nm (55lbs.ins) is reached on
all bolts at both ends.
It is not acceptable to fully tighten one fixing bolt before starting
to tighten the others. Such action may DAMAGE the module.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MP02X175 | MB 32C 32#20 SKT RECP |
| MP02X175-10 | MB 32C 32#20 SKT RECP |
| MP02X175-12 | MB 8C 8#12 SKT RECP |
| MP02X175-14 | MB 8C 8#12 PIN RECP |
| MP02X175-16 | MB 16C 16#16 PIN RECP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MP02X175 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP02X175-10 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP02X175-12 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP02X175-14 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP02X175-16 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。