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參數(shù)資料
| 型號： | MNA14 |
| 廠商： | Rohm CO.,LTD. |
| 英文描述： | Multi-layer Ceramic Chip Capacitors Networks(多層陶瓷電容) |
| 中文描述： | 多層陶瓷電容網(wǎng)絡(luò)（多層陶瓷電容） |
| 文件頁數(shù)： | 4/8頁 |
| 文件大?。?/td> | 105K |
| 代理商： | MNA14 |
MNA14
Ceramic capacitors
C (X7R)
-55
C
~ + 125
C
Class 2 (High dielectric constant)
Temperature characteristics
Item
Operating temperature
Nominal capacitance (C)
Dissipation factor (Tan
δ
)
Insulation resistance (IR)
Withstanding voltage
Temperature characteristics
Terminal adherence
Resistance
to vibration
Appearance
Rate of capacitance change
Dissipation factor (Tan
δ
)
Solderability
Resistance
to soldering
heat
Appearance
Rate of capacitance change
Dissipation factor (Tan
δ
)
Insulation resistance
Withstanding voltage
Temperature
cycling
Appearance
Rate of capacitance change
Dissipation factor (Tan
δ
)
Insulation resistance
Humidity load
test
Appearance
Rate of capacitance change
Dissipation factor (Tan
δ
)
Insulation resistance
High-
temperature
load test
Appearance
Rate of capacitance change
Dissipation factor (Tan
δ
)
Insulation resistance
Must be within the specified tolerance range.
2.5% or less
(when rated voltage is 16V: 3.5% or less)
10,000 M
or 500M
μ
F, whichever is smaller
The insulation must not be damaged.
Within ± 15%
No peeling or sign of peeling on terminal.
There must be no mechanical damage.
Must be within initial tolerance.
Must satisfy initial specified value.
At least 3/4 of the surface of the two terminals must be covered with new solder.
There must be no mechanical damage.
Within ± 5.0%
Must satisfy initial specified value.
10,000 M
or 500M
μ
F, whichever is smaller
The insulation must not be damaged.
There must be no mechanical damage.
Within ± 7.5%
Must satisfy initial specified value.
10,000 M
or 500M
μ
F, whichever is smaller
There must be no mechanical damage.
± 12.5% or less
5.0%or less
500 M
or 25M
μ
F, whichever is smaller
There must be no mechanical damage.
Within ± 10.0%
5.0% or less
1,000M
or 50M
μ
F, whichever is smaller
Test methods/conditions
(based on JIS C 5102)
Based on paragraph 7.8
Measured at room temperature and standard humidity.
Measurement frequency
Measurement voltage
: 0.1 ± 0.2 Vrms.
Based on paragraph 7.6
Measurement is made after rated voltage
is applied for 60 ± 5s.
Based on paragraph 7.1
Apply 250% of the rated voltage
for 1 to 5s then measure.
The temperature coefficients in paragraph 7.12,
table 8, condition B, are based on measurements
carried out at 20
C
, with no voltage applied.
Based on paragraph 8.11.2.
Apply 5N (0.51 kg
·
f) for 10 ± 1s
in the direction indicated
by the arrow.
Capacitor
Test board
Chip is mounted to a board in the
manner shown on the right, subjected
to vibration (type A in paragraph 8.2),
and measured 48 ± 4 hrs. later.
Board
Soldering temperature
Soldering time
Based on paragraph 8.14.
Soldering temperature
Soldering time
Preheating
Based on paragraph 9.3
Number of cycles: 10
Capacitance measured after 48 ± 4 hrs.
Test temperature
Relative humidity
Applied voltage
Test time
Capacitance measured after 48 ± 4 hrs.
Applied voltage
Test time
Capacitance measured after 48 ± 4 hrs.
Test temperature
: 1 ± 0.1 kHz
Based on paragraph 8.13
: 235 ± 5
C
: 2 ± 0.5s
: 260 ± 5
C
: 5 ± 0.5s
: 150 ± 10
C
for
1 to 2 min.
Based on paragraph 9.9
: 40 ± 2
C
: 90% to 95%
: rated voltage
Based on paragraph 9.10
: Max. operating temp.
: rated voltage x 200%
: 1,000 to 1,048 hrs.
*The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
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