Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Voltage at LED Outputs
V
SS
b
0.5V to V
SS
a
12V
V
SS
b
0.5V to V
SS
a
10V
Voltage at Other Pins
Operating Temperature
b
40
§
C to
a
85
§
C
b
40
§
C to
a
150
§
C
Storage Temperature
Power Dissipation at 25
§
C
Molded DIP Package, board mount
Molded DIP Package, socket mount
*
Molded DIP Package, board mount,
derate 15.8m W/
§
C above 25
§
C.
**
Molded DIP Package, socket mount,
derate 14.5m W/
§
C above 25
§
C.
Lead Temperature (Soldering, 10 sec.)
2W
*
1.8W
**
i
JA
e
63
§
C/W,
i
JA
e
69
§
C/W,
300
§
C
DC Electrical Characteristics
V
DD
e
4.5V to 9V, T
A
e b
40
§
C to
a
85
§
C unless otherwise specified
Parameter
Conditions
Min
Typ
Max
Units
Supply Voltage
4.5
9
V
Supply Current
5
10
mA
Logic One
Input High Level V
IH
2.4
V
DD
a
0.5
V
Logic Zero
Input Low Level V
IL
Input Current
Input Capacitance
0
0.8
g
1
7.5
V
High or Low Level
m
A
pF
OUTPUTS
Data Output Voltage
High Level V
OH
Low Level V
OL
Segment Off
(Logic Zero on Input)
I
OUT
e
0.1 mA
I
OUT
e b
0.1 mA
V
OUT
e
12V
R
EXT
e
400
X
V
DD
b
0.5
V
V
0.5
50
m
A
Output Current Segment On
(Logic One on Input)
Output Voltage
I
OUT
e
15 mA
V
DD
t
6V
0.5
1.0
V
AC Electrical Characteristics
(SeeFigure 3.) V
DD
e
4.5V to 9V, T
A
e b
40
§
C to
a
85
§
C unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Units
f
C
Clock Frequency
0.5
MHz
t
h
High Time
0.95
m
s
t
l
Low Time
0.95
m
s
t
S1
Data Setup Time
0.5
m
s
t
H1
Data Hold Time
0.5
m
s
t
S2
Enable Setup Time
0.5
m
s
t
H2
Enable Hold Time
0.5
m
s
t
pd
Data Out Delay
0.5
m
s
Note 1:
Under no condition should the power dissipated by the segment driver exceed 50 mW nor the entire chip power dissipation exceed 500 mW.
Note 2:
AC input waveform specification for test purpose: t
r
s
20 ns, t
f
s
20 ns, f
e
500 kHz, 50%
g
10% duty cycle.
Note 3:
Clock input rise and fall times must not exceed 500 ns.
2