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參數(shù)資料
| 型號(hào)： | MM1664G |
| 廠(chǎng)商： | MITSUMI ELECTRIC |
| 英文描述： | 1000mA Regulator Monolithic |
| 中文描述： | 千毫安調(diào)節(jié)單片 |
| 文件頁(yè)數(shù)： | 6/8頁(yè) |
| 文件大小： | 73K |
| 代理商： | MM1664G |
MITSUMI
1000mA Regulator MM166 F
Characteristics
(3.0V product Except where noted therwise, Ta=25°C, V
IN
=5V, V
CONT
=5V, C
IN
=1
μ
F, C
O
=2.2
μ
)
Application Circuit
NC
2
1
GND
3
7
6
NC NC
V
IN
Cn
4
Cont
V
O
8
5
1.0
μ
F
Ceramic
0.1
μ
F
2.2
μ
F
Ceramic
Input
To load
Cn=470pF
Ceramic
Note
1. The output capacitor is required between output and GND to prevent oscillation.
2. The ESR of capacitor must be defined in ESR stability area.
3. The wire of Vcc and GND is required to print full ground plane for noise and stability.
4. The input capacitor must be connected a distance of less than 1cm from input pin.
5. The capacitor is connected to Cn must have low leakage current characteristics, because Cn pin is high
impedance.
6. In case the output voltage is above the input voltage, the overcurrent flow by internal parasitic diode from
output to input. In such application, the external bypass diode must be connected between output and
input pin.
GND
1
3
2
V
IN
V
O
1.0
μ
F
Ceramic
0.1
μ
F
2.2
μ
F
About Power dissipation
This IC's GND pin and Heat Spreader Bottom effectively radiate heat. By increasing these copper foil pattern
area of PCB, Power dissipation improves. Please kindly desigh PCB pattern taking care of above features
about power dissipation.
Power Dissipation
0
500
1000
1500
2000
2500
3000
0
25
50
Ambient Temperature(
C)
75
100
125
150
P
HSOP-8 : 37mm 37mm 1.6mm
Double sided glass epoxy Copper plane 80%
To-252 : 150mm 100mm 1.0mm
Double sided glass epoxy Copper plane 80%
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