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參數(shù)資料
| 型號： | ML0XX18 |
| 廠商： | Mitsubishi Electric Corporation |
| 英文描述： | 10Gb/s EA Modulator Driver IC |
| 中文描述： | 10Gb / s的電吸收調(diào)制器驅(qū)動IC |
| 文件頁數(shù)： | 9/9頁 |
| 文件大?。?/td> | 456K |
| 代理商： | ML0XX18 |
MITSUBISHI ICs for Optical Communication
M L 0 X X 1 8
10Gb/s EA Modulator Driver IC
NOTIFICATION FOR BARE DIE SUPPLY (ML0CP18)
1. Quality
After the reception of bare die by the customer, performance, yield and reliability of the application of the bare die will not be
guaranteed. The supplier does not have the responsibility for field failures in the applied product.
2. Storage
a) Store in dry nitrogen.
< Before opening shipped conductive film bag (dry N2 sealed) >
Temperature
: 15 to 35 deg. C
Humidity : 45% - 75% RH
Term
: 3 months
< After opening >
Temperature
: 15 to 35 deg. C
Atmosphere
: Dry N2 gas
(The dew point should be less than -30 deg. C)
(No contact with gas including ammonia and sulfur)
Term
: The appearance of the bare die is not guaranteed after its opening.
b) Don’t apply excess vibration or shock.
3. Opening a package
a) Handle devices in clean room or on clean bench.
b) Take measures to avoid electro-static damage.
c) To open a film bag, please use scissors or a knife.
d) When taking out the devices, never touch devices barehanded. Please use clean tweezers or similar.
When use tweezers, please catch a device by side to avoid cracking or damaging the device.
Since gallium arsenide is more brittle material than silicon, special care must be taken.
4. Die bonding
The following methods are recommended for die bonding.
a) Die should be bonded lower than 300 deg. C.
b) The time duration of die bonding at maximum temperature is recommended to be shorter than 15 sec.
c) Cool down gradually, to avoid chip crack.
d) All die bonding equipment and workers should be grounded.
5. Wire bonding
The following methods are recommended for wire bonding.
a) Bonding force of wire bonding is recommended to be less than 55 grams with ultrasonic.
b) Check ultrasonic power not to damage on die and die pads.
c) Cool down gradually.
d) All wire bonding equipment and workers should be grounded.
6. Design
a) It is recommended to use this product in a hermetic sealed condition (N2 sealed).
b) It is recommended for customer to verify the performance and the qualification by customer's final product.
Especially, oscillation and noise generation might happen.
MITSUBISHI
ELECTRIC
- 9 -
Notice: This is not a final specification.
Some parametric limits are subject to change.
‘04/1/14 rev.2.1
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