參數(shù)資料
型號(hào)： ML01618
廠商： Mitsubishi Electric Corporation
英文描述： 10Gb/s EA Modulator Driver IC
中文描述： 10Gb / s的電吸收調(diào)制器驅(qū)動(dòng)IC
文件頁數(shù)： 6/9頁
文件大小： 456K
代理商： ML01618
MITSUBISHI ICs for Optical Communication
M L 0 X X 1 8
10Gb/s EA Modulator Driver IC
PACKAGE DESCRIPTION (ML01618)
MITSUBISHI
ELECTRIC
- 6 -
Notice: This is not a final specification.
Some parametric limits are subject to change.
‘04/1/14 rev.2.1
Figure 5. Package Drawing of 32-pin Small Lead-frame Package (SLP)
Figure 6. Pin assignment of ML01618 (SLP)
Exposed die pad portion on the back
side of SLP needs to be connected to
GND. In other words, when VEE is
supplied by -5.2V, supply 0V to the die
pad. In the case of positive power
supply (+5.2V to GND terminals and
0V to VEE), supply +5.2V to the die
pad. For the detailed information for
the positive power supply usage,
please contact to your local rep.
The pins specified as NC need to be
left “OPEN”.
Pin 21”GNDO”, pin 20”GNDON” and
pin 32”GND” are not connected to
“GND” line inside chip. Connect these
pins to GND externally.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
IINBIAS
G ND
DATA
G ND
G ND
DATAN
G ND
NC
N
G
C
G
G
C
G
N
CSEL
G ND
O UT
G NDO
G NDO N
O UTN
G ND
NC
G
C
G
V
V
G
I
I
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