參數(shù)資料
型號: MK5812SLF
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 3/7頁
文件大?。?/td> 0K
描述: IC CLK GENERATOR LOW EMI 8-SOIC
標準包裝: 97
類型: 時鐘發(fā)生器
PLL:
輸入: 時鐘,晶體
輸出: LVCMOS
電路數(shù): 1
比率 - 輸入:輸出: 1:1
差分 - 輸入:輸出: 無/無
頻率 - 最大: 64MHz
除法器/乘法器: 無/是
電源電壓: 3 V ~ 3.63 V
工作溫度: 0°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應商設備封裝: 8-SOIC
包裝: 管件
MK5812
LOW EMI CLOCK GENERATOR
SSCG
IDT LOW EMI CLOCK GENERATOR
3
MK5812
REV C 051310
Pin Descriptions
External Components
The MK5812 requires a minimum number of external
components for proper operation.
Decoupling Capacitor
A decoupling capacitor of 0.01F must be connected
between VDD and GND on pins 7 and 2. Connect the
capacitor as close to these pins as possible. For optimum
device performance, mount the decoupling capacitor on the
component side of the PCB. Avoid the use of vias in the
decoupling circuit.
Series Termination Resistor
Use series termination when the PCB trace between the
clock output and the load is over 1 inch. To series terminate
a 50
trace (a commonly used trace impedance), place a
33
resistor in series with the clock line. Place the resistor
as close to the clock output pin as possible. The nominal
impedance of the clock output is 20
.
Tri-level Select Pin Operation
The S1 and S0 select pins are tri-level, meaning that they
have three separate states to make the selections shown in
the table on page 2. To select the M (mid) level, the
connection to these pins must be eliminated by either
floating them originally, or tri-stating the GPIO pins which
drive the select pins.
PCB Layout Recommendations
For optimum device performance and lowest output phase
noise, observe the following guidelines:
1) Mount the 0.01F decoupling capacitor on the
component side of the board as close to the VDD pin as
possible. No vias should be used between the decoupling
capacitor and VDD pin. The PCB trace to the VDD pin and
the PCB trace to the ground via should be kept as short as
possible.
2) To minimize EMI, place the 33
series-termination
resistor (if needed) close to the clock output.
3) An optimum layout is one with all components on the
same side of the board, thus minimizing vias through other
signal layers. Other signal traces should be routed away
from the MK5812 device. This includes signal traces located
underneath the device, or on layers adjacent to the ground
plane layer used by the device.
Crystal Information
The crystal used should be a fundamental mode (do not use
third overtone), parallel resonant crystal. To optimize the
initial accuracy, connect crystal capacitors from pins X1 to
ground and X2 to ground. The value of these capacitors is
given by the following equation:
Crystal caps (pF) = (CL - 6) x 2
Pin
Number
Pin
Name
Pin Type
Pin Description
1
X1/ICLK
Input
Connect to 4-32 MHz crystal or clock.
2
GND
Power
Connect to ground.
3
S1
Input
Function select 1 input. Selects spread amount and direction per table above.
(default-internal mid-level).
4
S0
Input
Function select 0 input. Selects spread amount and direction per table above.
(default-internal mid-level).
5
SSCLK
Output
Clock output with Spread spectrum
6
FRSEL
Input
Function select for input frequency range. Default to mid level “M”.
7
VDD
Power
Connect to +3.3 V.
8
X2
XO
Crystal connection to 4-32 MHz crystal. Leave unconnected for clock
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