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參數(shù)資料
| 型號(hào)： | MK51DX256ZCMC10R |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121 |
| 封裝： | 8 X 8 MM, MAPBGA-121 |
| 文件頁數(shù)： | 26/72頁 |
| 文件大小： | 1005K |
| 代理商： | MK51DX256ZCMC10R |
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3. Crystal startup time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S register
being set.
6.3.3 32kHz Oscillator Electrical Characteristics
This section describes the module electrical characteristics.
6.3.3.1 32kHz oscillator DC electrical specifications
Table 18. 32kHz oscillator DC electrical specifications
Symbol
Description
Min.
Typ.
Max.
Unit
VBAT
Supply voltage
1.71
—
3.6
V
RF
Internal feedback resistor
—
100
—
MΩ
Cpara
Parasitical capacitance of EXTAL32 and XTAL32
—
2.5
—
pF
Cload
Internal load capacitance (programmable)
—
15
—
pF
Vpp1
Peak-to-peak amplitude of oscillation
—
0.6
—
V
1. The EXTAL32 and XTAL32 pins should only be connected to required oscillator components and must not be connected to
any other devices.
6.3.3.2 32kHz oscillator frequency specifications
Table 19. 32kHz oscillator frequency specifications
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
fosc_lo
Oscillator crystal
—
32.768
—
kHz
tstart
Crystal start-up time
—
1000
—
ms
1. Proper PC board layout procedures must be followed to achieve specifications.
6.4 Memories and memory interfaces
6.4.1 Flash (FTFL) electrical specifications
This section describes the electrical characteristics of the FTFL module.
6.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Peripheral operating requirements and behaviors
K51 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
32
Preliminary
Freescale Semiconductor, Inc.
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