T
參數(shù)資料
型號(hào): MK30DN512ZVLQ10
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 15/74頁(yè)
文件大?。?/td> 0K
描述: IC ARM CORTEX MCU 512KB 144LQFP
標(biāo)準(zhǔn)包裝: 300
系列: Kinetis
核心處理器: ARM? Cortex?-M4
芯體尺寸: 32-位
速度: 100MHz
連通性: CAN,EBI/EMI,I²C,IrDA,SDHC,SPI,UART/USART
外圍設(shè)備: DMA,I²S,LCD,LVD,POR,PWM,WDT
輸入/輸出數(shù): 102
程序存儲(chǔ)器容量: 512KB(512K x 8)
程序存儲(chǔ)器類(lèi)型: 閃存
RAM 容量: 128K x 8
電壓 - 電源 (Vcc/Vdd): 1.71 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 37x16b,D/A 2x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 105°C
封裝/外殼: 144-LQFP
包裝: 托盤(pán)
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
105
°C
5.4.2 Thermal attributes
Board type
Symbol
Description
144 LQFP
144
MAPBGA
Unit
Notes
Single-layer
(1s)
RθJA
Thermal
resistance,
junction to
ambient (natural
convection)
45
48
°C/W
Four-layer
(2s2p)
RθJA
Thermal
resistance,
junction to
ambient (natural
convection)
36
29
°C/W
Single-layer
(1s)
RθJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
36
38
°C/W
Four-layer
(2s2p)
RθJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
30
25
°C/W
RθJB
Thermal
resistance,
junction to
board
24
16
°C/W
RθJC
Thermal
resistance,
junction to case
9
°C/W
ΨJT
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
2
°C/W
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
General
K30 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
22
Freescale Semiconductor, Inc.
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