參數(shù)資料
型號(hào)： MF1S7009DA4
廠商： NXP SEMICONDUCTORS
元件分類： 電源管理
英文描述： Mainstream contactless smart card IC for fast and easy solution development
中文描述： 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PXMA
封裝： PLASTIC, SOT-500-2
文件頁(yè)數(shù)： 5/34頁(yè)
文件大?。?/td> 270K
代理商： MF1S7009DA4
MF1S7009
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3 — 26 July 2010
193031
5 of 34
NXP Semiconductors
MF1S7009
Mainstream contactless smart card IC
[1]
The gap between chips may vary due to changing foil expansion.
[2]
Pads P1, TP2 and VSS are disconnected when wafer is sawn.
7.1 Fail die identification
Electronic wafer mapping covers the electrical test results and additionally the results of
mechanical/visual inspection.
No ink dots are applied.
gap between chips
[1]
typical = 15
μ
m
minimum = 5
μ
m
Passivation
type
material
thickness
Au bump (substrate connected to VSS)
material
hardness
shear strength
height
height uniformity
sandwich structure
nitride
1.75
μ
m
>
99.9 % pure Au
35 to 80 HV 0.005
>70 MPa
18
μ
m
within a die =
±
2
μ
m
within a wafer =
±
3
μ
m
wafer to wafer =
±
4
μ
m
minimum =
±
1.5
μ
m
LA, LB = 69
μ
m
×
69
μ
m
P1;TP2;VSS
[2]
= 58
μ
m
×
58
μ
m
±
5
μ
m
sputtered TiW
flatness
size
size variation
under bump metallization
Table 3.
Specifications
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參數(shù)描述
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MF1S7009DUD,005 功能描述:RFID應(yīng)答器 MAINSTREAM CNTCTLESS SMART CARD IC RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1S7030XDA4 制造商:NXP Semiconductors 功能描述:Cut Tape
MF1S7030XDA4,118 功能描述:RFID應(yīng)答器 4KB 16bit 106Kbps RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1S7031XDUD,005 功能描述:MIFARE CLASSIC 4K SMART CARD IC RoHS:是 類別:未定義的類別 >> 其它 系列:* 標(biāo)準(zhǔn)包裝:1 系列:* 其它名稱:MS305720A
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