參數(shù)資料
型號: MF1S5037DUA
廠商: NXP Semiconductors N.V.
元件分類: 外設(shè)及接口
英文描述: MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development
封裝: MF1S5030DA3<SOT500|<<<1<Always Pb-free,;MF1S5030DA4<SOT500-2 (PLLMC)|<<http://www.nxp.com/packages/SOT500-2.html<1<Always Pb-free,;MF1S5030DA6<SOT500-3 (PLLMC)|&
文件頁數(shù): 3/37頁
文件大?。?/td> 425K
代理商: MF1S5037DUA
MF1S503x
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.1 — 21 February 2011
194031
3 of 37
NXP Semiconductors
MF1S503x
MIFARE Classic 1K - Mainstream contactless smart card IC
5. Ordering information
6. Block diagram
Table 2.
Type number
Ordering information
Package
Commercial
Name
FFC Bump
Name
Description
Version
MF1S5035DUD/L
-
8 inch wafer, 120
μ
m thickness, laser diced, on film frame
carrier, electronic fail die marking according to SECSII format),
Au bumps
8 inch wafer, 120
μ
m thickness, laser diced, on film frame
carrier, electronic fail die marking according to SECSII format)
8 inch wafer, 150
μ
m thickness, on film frame carrier, electronic
fail die marking according to SECSII format), Au bumps
8 inch wafer, 150
μ
m thickness, on film frame carrier, electronic
fail die marking according to SECSII format)
plastic leadless module carrier package; 35 mm wide tape
plastic leadless module carrier package; 35 mm wide tape
plastic leadless module carrier package; 35 mm wide tape
plastic leadless module carrier package; 35 mm wide tape
not
applicable
MF1S5035DUH/L
FFC
-
not
applicable
not
applicable
not
applicable
SOT500-1
SOT500-2
SOT500-3
SOT500-4
MF1S5037DUG
FFC Bump
-
MF1S5037DUA
FFC
-
MF1S5030DA3
MF1S5030DA4
MF1S5030DA6
MF1S5030DA8
MOA2
MOA4
MOB6
MOA8
PLLMC
PLLMC
PLLMC
PLLMC
Fig 2.
Block diagram of MF1S503x
001aan006
RF
INTERFACE
UART
ISO/IEC 14443A
TYPE A
LOGIC UNIT
RNG
CRC
EEPROM
CRYPTO1
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR
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