參數(shù)資料
型號： MF1S5030DA8
廠商： NXP Semiconductors N.V.
元件分類： 外設及接口
英文描述： MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development
封裝： MF1S5030DA3<SOT500|<<<1<Always Pb-free,;MF1S5030DA4<SOT500-2 (PLLMC)|<<http://www.nxp.com/packages/SOT500-2.html<1<Always Pb-free,;MF1S5030DA6<SOT500-3 (PLLMC)|&
文件頁數(shù)： 23/37頁
文件大?。?/td> 425K
代理商： MF1S5030DA8
MF1S503x
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.1 — 21 February 2011
194031
23 of 37
NXP Semiconductors
MF1S503x
MIFARE Classic 1K - Mainstream contactless smart card IC
13. Wafer specification
For more details on the wafer delivery forms see
Ref. 6
.
Table 24.
Wafer
diameter
maximum diameter after foil expansion
thickness
flatness
Potential Good Dies per Wafer (PGDW)
Wafer backside
material
treatment
roughness
[1]
the gap between chips may vary due to changing foil expansion
Table 25.
Wafer
diameter
thickness
flatness
Potential Good Dies per Wafer (PGDW)
Wafer backside
material
treatment
roughness
Wafer specifications MF1S5035DUx/L
200 mm typical (8 inches)
210 mm
120
μ
m
±
15
μ
m
not applicable
27720
Si
ground and stress relieve
R
a
max = 0.5
μ
m
R
t
max = 5
μ
m
Chip dimensions
step size
x = 1062
μ
m
y = 1012
μ
m
typical = 27
μ
m
minimum = 5
μ
m
gap between chips
[1]
Passivation
type
material
thickness
sandwich structure
PSG / nitride
500 nm / 600 nm
Wafer specifications MF1S5037DUx
200 mm typical (8 inches)
120
μ
m
±
15
μ
m
not applicable
25060
Si
ground and stress relieve
R
a
max = 0.5
μ
m
R
t
max = 5
μ
m
Chip dimensions
step size
x = 1100
μ
m
y = 1030
μ
m
x = 86,4
μ
m
y = 66,4
μ
m
scribe line
相關PDF資料
PDF描述
MF1S5035DUD MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development
MF1S5035DUH MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development
MF1S5037DUA MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development
MF1S5037DUG MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development
MF1S7000XDA4 MIFARE Classic 4K - Mainstream contactless smart card IC for fast and easy solution development
相關代理商/技術參數(shù)
參數(shù)描述
MF1S5030DA8,118 功能描述:RFID應答器 1KB 16bit 106Kbps RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1S5030XDA4 制造商:NXP Semiconductors 功能描述:Cut Tape
MF1S5030XDA4,118 功能描述:RFID應答器 1KB 16bit 106Kbps RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1S5030XDA4/V1J 功能描述:RFID Transponder IC 13.56MHz ISO 14443, MIFARE UART MOA4, Smart Card Module 制造商:nxp semiconductors 系列:MIFARE? 包裝:* 零件狀態(tài):有效 類型:RFID 應答器 頻率:13.56MHz 標準:ISO 14443，MIFARE 接口:UART 電壓 - 電源:- 工作溫度:-25°C ~ 70°C 封裝/外殼:MOA4，智能卡模塊 供應商器件封裝:* 標準包裝:1
MF1S5031XDUD,005 功能描述:MIFARE CLASSIC 1K SMART CARD IC RoHS:是 類別:未定義的類別 >> 其它 系列:* 標準包裝:1 系列:* 其它名稱:MS305720A
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*