參數(shù)資料
型號(hào): MF1PLUS8031DA4
廠商: NXP Semiconductors N.V.
元件分類: 外設(shè)及接口
英文描述: Mainstream contactless smart card IC for fast and easy solution development
文件頁(yè)數(shù): 19/20頁(yè)
文件大?。?/td> 154K
代理商: MF1PLUS8031DA4
MF1PLUSX0Y1_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
163532
19 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
16. Tables
Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .2
Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .3
Table 3. Bonding pad assignments to smart card
contactless module. . . . . . . . . . . . . . . . . . . . . . .5
Table 4. ISO/IEC 14443-3 . . . . . . . . . . . . . . . . . . . . . . .11
Table 5. ISO/IEC 14443-4 . . . . . . . . . . . . . . . . . . . . . . .12
Table 6. Security level 0 command overview . . . . . . . . .12
Table 7. Security level 1 command overview. . . . . . . . . 12
Table 8. Security level 2 command overview. . . . . . . . . 13
Table 9. Security level 3 command overview . . . . . . . . 13
Table 10. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 11. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 12. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
17. Figures
Fig 1.
Fig 2.
Fig 3.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Contact assignments for SOT500-2 (MOA4). . . . .5
Memory organization . . . . . . . . . . . . . . . . . . . . . . .6
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MF1PLUS8031DA4/03, 功能描述:RFID應(yīng)答器 RFID MODULES DEV TOOLS RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1PLUS8031DA403 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development
MF1PLUS8031DUD/03, 功能描述:RFID應(yīng)答器 RFID MODULES & DEVELOPMENT TOOLS RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1PLUS8031DUD03 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development
MF1PLUSX0Y1 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development