參數(shù)資料
型號(hào)： MCZ33996EKR2
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： 16-Output Switch with SPI Control
中文描述： 16輸出帶有SPI控制開(kāi)關(guān)
文件頁(yè)數(shù)： 19/23頁(yè)
文件大?。?/td> 306K
代理商： MCZ33996EKR2
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
33996
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33996 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
The MC33996 is offered in a 32 pin SOICW exposed pad, single die package.
There is a single heat source (P), a single junction temperature (T
J
), and thermal
resistance (R
θ
JA
).
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not meant
to and will not predict the performance of a package in an application-specific
environment. Stated values were obtained by measurement and simulation
according to the standards listed below.
Standards
Figure 14. Surface Mount for SOICW Exposed Pad
32-PIN
SOICW-EP
33996EK
EK (PB-FREE) SUFFIX
98ARL10543D
32-PIN SOICW-EP
Note
For package dimensions, refer to
the 33996 data sheet.
T
J
=
R
θ
JA
.
P
Table 7. Thermal Performance Comparisons
Thermal Resistance
[
°
C/W]
R
θ
JA
(1)
,
(2)
29
R
θ
JB
(2)
,
(3)
9.0
R
θ
JA
(1)
,
(4)
69
R
θ
JC
(5)
2.0
Notes:
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2s2p thermal test board per JEDEC JESD51-5 and
JESD51-7.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
Thermal resistance between the die junction and the
exposed pad surface; cold plate attached to the package
bottom side, remaining surfaces insulated.
2.
3.
4.
5.
1.0
1.0
0.2
0.2
*All Measurements
are in Millimeters
32 Pin SOICW-EP
0.65 Pitch
11.0 mm x 7.5mm Body
4.6 mm x 5.7 mm Exposed Pad
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