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參數(shù)資料
| 型號(hào)： | MCZ33395EW |
| 廠(chǎng)商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | Three-Phase Gate Driver IC |
| 中文描述： | 三相柵極驅(qū)動(dòng)集成電路 |
| 文件頁(yè)數(shù)： | 5/16頁(yè) |
| 文件大?。?/td> | 282K |
| 代理商： | MCZ33395EW |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33395
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
VIGN Supply Voltage
V
IGN
V
IGNP
LD
-15.5 to 40
VDC
VIGNP Load Dump Survival
-0.3 to 65
VDC
VDD Logic Supply Voltage (Fail Safe)
V
DD
-0.3 to 7.0
VDC
Logic Input Voltage (LSEn, HSEn, PWM, and MODEn)
V
IN
0.3 to 7.0
VDC
Start Up Current V
IGNP
ESD Voltage
(1)
Human Body Model
Machine Model
I
VIGNSTARTUP
100
mA
V
ESD1
V
ESD2
±500
±200
V
Storage Temperature
T
STG
-65 to 160
°C
Operating Ambient Temperature
T
A
-40 to 125
°C
Operating Case Temperature
T
C
-40 to 125
°C
Maximum Junction Temperature
T
J
150
°C
Power Dissipation (T
A
= 25°C)
Peak Package Reflow Temperature During Reflow
(2)
,
(3)
P
D
1.5
W
°C
T
PPRT
Note 3
Thermal Resistance, Junction-to-Ambient
R
Θ
JA
65
°C/ W
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
), ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
2.
3.
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