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參數(shù)資料
| 型號： | MCP9701 |
| 廠商： | Microchip Technology Inc. |
| 元件分類： | 溫度/濕度傳感器 |
| 英文描述： | Low-Power Voltage Output Temperature Sensor |
| 中文描述： | 低功耗，電壓輸出溫度傳感器 |
| 文件頁數(shù)： | 10/18頁 |
| 文件大小： | 265K |
| 代理商： | MCP9701 |
MCP9700/01
DS21942A-page 10
2005 Microchip Technology Inc.
4.4
Thermal Considerations
The MCP9700/01 measures temperature by monitor-
ing the voltage of a diode located in the die. A low
impedance thermal path between the die and the PCB
is provided by the pins. Therefore, the MCP9700/01
effectively monitors the temperature of the PCB.
However, the thermal path for the ambient air is not as
efficient because the plastic device package functions
as a thermal insulator from the die. This limitation
applies to plastic-packaged silicon temperature
sensors. If the application requires measuring ambient
air, the PCB needs to be designed with proper thermal
conduction to the sensor pins.
The MCP9700/01 is designed to source/sink 100 μA
(max.). The power dissipation due to the output current
is relatively insignificant. The effect of the output
current can be described using Equation 4-2.
EQUATION 4-2:
EFFECT OF SELF-
HEATING
At T
A
= +25°C (V
OUT
= 0.75V) and maximum specifica-
tion of I
DD
= 12 μA, V
DD
= 5.5V and I
OUT
= +100 μA,
the self-heating due to power dissipation (T
J
– T
A
) is
0.179°C.
T
J
T
A
–
θ
JA
V
DD
I
DD
(
V
DD
V
OUT
–
(
)
+
I
OUT
)
=
Where:
T
J
T
A
θ
JA
V
OUT
= Sensor Output Voltage
I
OUT
= Sensor Output Current
I
DD
= Operating Current
V
DD
= Operating Voltage
= Junction Temperature
= Ambient Temperature
= Package Thermal Resistance (331°C/W)
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