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參數(shù)資料
| 型號： | MCP6001EOT |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | 1 MHz Bandwidth Low Power Op Amp |
| 中文描述： | 1 MHz帶寬低功耗運(yùn)算放大器 |
| 文件頁數(shù)： | 14/24頁 |
| 文件大?。?/td> | 553K |
| 代理商： | MCP6001EOT |
MCP6001/2/4
DS21733D-page 14
2003 Microchip Technology Inc.
5-Lead Plastic Small Outline Transistor (OT) (SOT23)
10
5
0
10
5
0
β
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
10
5
0
10
5
0
α
Mold Draft Angle Top
0.50
0.43
0.35
.020
.017
.014
B
Lead Width
0.20
0.15
0.09
.008
.006
.004
c
Lead Thickness
10
5
0
10
5
0
φ
Foot Angle
0.55
0.45
0.35
.022
.018
.014
L
Foot Length
3.10
2.95
2.80
.122
.116
.110
D
Overall Length
1.75
1.63
1.50
.069
.064
.059
E1
Molded Package Width
3.00
2.80
2.60
.118
.110
.102
E
Overall Width
0.15
0.08
0.00
.006
.003
.000
A1
Standoff
§
1.30
1.10
0.90
.051
.043
.035
A2
Molded Package Thickness
1.45
1.18
0.90
.057
.046
.035
A
Overall Height
1.90
.075
p1
Outside lead pitch (basic)
0.95
.038
p
Pitch
5
5
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
1
p
D
B
n
E
E1
L
c
β
φ
α
A2
A
A1
p1
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
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相關(guān)代理商/技術(shù)參數(shù) |
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| MCP6001EP | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
| MCP6001ESL | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
| MCP6001ESN | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
| MCP6001EST | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
| MCP6001I | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
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