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| 型號(hào)： | MCP201T-I/SN |
| 廠商： | Microchip Technology |
| 文件頁(yè)數(shù)： | 6/40頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC LIN TXRX ON-BOARD VREG 8SOIC |
| 產(chǎn)品培訓(xùn)模塊： | Microchip MCP20xx LIN Transceiver Overview |
| 標(biāo)準(zhǔn)包裝： | 3,300 |
| 類型： | 線路收發(fā)器 |
| 驅(qū)動(dòng)器/接收器數(shù)： | 1/1 |
| 規(guī)程： | LIN |
| 電源電壓： | 6 V ~ 18 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOICN |
| 包裝： | 帶卷 (TR) |
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MCP201
DS21730F-page 14
2007 Microchip Technology Inc.
2.2
DC Specifications
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBAT = 6.0V to 18.0V
TAMB = -40°C to +125°C
CLOADREG = 10 F
Sym.
Parameter
Min.
Typ.
Max.
Units
Conditions
Power
IBATQ
VBAT Quiescent Operating
Current (voltage regulator
without load and transceiver)
—
0.45
1.0
mA
IVREG = 0 mA, LIN bus pin
recessive, (Note 3)
IBAT
VBAT Power-down Current
transceiver only
—
23
50
A
CS/WAKE = High, voltage
regulator disabled
IDDQ
VREG Quiescent Operating
Current
—500
—
A
IVREG
VREG maximum output
current
——
50
mA
Microcontroller Interface
VIH
High-level Input Voltage
(TXD, FAULT/SLPS)
2.0
—
VREG + 0.3
V
VIL
Low-level Input Voltage
(TXD, FAULT/SLPS)
-0.3
—
0.15 x VREG
V
IIHTXD
High-level Output Current
(TXD)
-90
—
+30
A
Input voltage = 4V
IILTXD
Low-level Output Current
(TXD)
-150
—
-10
A
Input voltage = 1V (though
> 50 k
Ω internal pull-up)
VIHCS/
WAKE
High-level Input Voltage
(CS/WAKE)
3.0
—
VBAT
V
Through an external current-
limiting resistor (10 k
Ω)
VILCS/
WAKE
Low-level Input Voltage
(CS/WAKE)
-0.3
—
1.0
V
IIHCS/
WAKE
High-level Input Current
(CS/WAKE)
-10
—
+80
A
Input voltage = 4V (though
>100 k
Ω internal pull-down)
IILCS/
WAKE
Low-level Input Current
(CS/WAKE)
5
—
30
A
Input voltage = 1V
VOHRXD
High-level Output Voltage
(RXD)
0.8
VREG
——
IOH = -4 mA
VOLRXD
Low-level Output Voltage
(RXD)
——
0.2 VREG
IOL = 4 mA
Note 1:
Internal current limited. 2.0 ms typical recovery time (RLBUS = 0
Ω, TX = 0.4 VREG, VLBUS = VBAT, TAMB =
25C. Recovery time highly dependent on ambient temperature, package and thermal resistance).
2:
For design guidance only, not tested.
3:
This current is at the VBAT pin.
4:
The maximum power dissipation is a function of TJMAX,
ΘJA and ambient temperature TA. The maximum
allowable power dissipation at an ambient temperature is PD = (TJMAX - TA)
ΘJA. If this dissipation is
exceeded, the die temperature will rise above 150
°C and the MCP201 will go into thermal shutdown.
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