參數(shù)資料
型號(hào): MCP201-I/P
廠商: Microchip Technology
文件頁數(shù): 28/40頁
文件大?。?/td> 0K
描述: IC LIN TXRX ON-BOARD VREG 8DIP
產(chǎn)品培訓(xùn)模塊: Microchip MCP20xx LIN Transceiver Overview
標(biāo)準(zhǔn)包裝: 60
類型: 線路收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: LIN
電源電壓: 6 V ~ 18 V
安裝類型: 通孔
封裝/外殼: 8-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 8-PDIP
包裝: 管件
產(chǎn)品目錄頁面: 685 (CN2011-ZH PDF)
MCP201
DS21730F-page 34
2007 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
1.27 BSC
Overall Height
A
1.75
Molded Package Thickness
A2
1.25
Standoff
§
A1
0.10
0.25
Overall Width
E
6.00 BSC
Molded Package Width
E1
3.90 BSC
Overall Length
D
4.90 BSC
Chamfer (optional)
h
0.25
0.50
Foot Length
L
0.40
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
Lead Thickness
c
0.17
0.25
Lead Width
b
0.31
0.51
Mold Draft Angle Top
α
15°
Mold Draft Angle Bottom
β
15°
D
N
e
E
E1
NOTE 1
12
3
b
A
A1
A2
L
L1
c
h
φ
β
α
Microchip Technology Drawing C04-057B
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