參數(shù)資料
型號： MCP1630V
廠商： Microchip Technology Inc.
英文描述： High-Speed, Microcontroller-Adaptable, Pulse Width Modulator
中文描述： 高速微控制器適應(yīng)性，脈寬調(diào)制器
文件頁數(shù)： 7/26頁
文件大?。?/td> 268K
代理商： MCP1630V
2005 Microchip Technology Inc.
DS21896B-page 7
MCP1630/MCP1630V
TEMPERATURE SPECIFICATIONS
Electrical Specifications:
V
IN
= 3.0V to 5.5V, F
OSC
= 1 MHz with 10% Duty Cycle, C
IN
= 0.1 μF. T
A
= -40°C to +125°C.
Current Sense Input
Maximum Current Sense Signal
MCP1630
Delay From CS to V
EXT
MCP1630
Maximum Current Sense Signal
MCP1630V
V
CS_MAX
0.85
0.9
0.95
V
Set by maximum error amplifier
clamp voltage, divided by 3.
T
CS_VEXT
—
12
25
ns
V
CS_MAX
2.55
2.7
2.85
V
V
IN
> 4.25V
Maximum CS input range limited by
comparator input common mode
range. V
CS_MAX
= V
IN
-1.4V
Delay From CS to V
EXT
MCP1630V
Minimum Duty Cycle
T
CS_VEXT
—
17.5
35
ns
DC
MIN
—
—
0
%
V
FB
= V
REF
+ 0.1V,
V
CS
= GND
V
IN
= 5V
Current Sense Input Bias Current
Internal Driver
R
DSON
P-channel
R
DSON
N-channel
V
EXT
Rise Time
I
CS_B
—
-0.1
—
μA
R
DSon_P
R
DSon_N
T
RISE
—
—
—
10
7
5.9
30
30
18
Ω
Ω
ns
C
L
= 100 pF
Typical for V
IN
= 3V
C
L
= 100 pF
Typical for V
IN
= 3V
V
EXT
Fall Time
T
FALL
—
6.2
18
ns
Protection Features
Under Voltage Lockout
UVLO
2.7
—
3.0
V
V
IN
falling, V
EXT
low state when in
UVLO
Under Voltage Lockout Hysteresis
Thermal Shutdown
Thermal Shutdown Hysteresis
Note
1:
Capable of higher frequency operation depending on minimum and maximum duty cycles needed.
2:
External oscillator input (OSC IN) rise and fall times between 10 ns and 10 μs used for characterization testing. Signal
levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum
values. Not production tested.
3:
The reference input of the internal amplifier is capable of rail-to-rail operation.
UVLO
HYS
T
SHD
T
SHD_HYS
50
—
—
75
150
18
150
—
—
mV
°C
°C
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Operating Junction Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Thermal Package Resistances
Thermal Resistance, 8L-DFN
(2 mm x 3 mm)
Thermal Resistance, 8L-MSOP
T
A
T
A
T
J
-40
-65
—
—
—
—
+125
+150
+150
°C
°C
°C
Steady state
Transient
θ
JA
—
50.8
—
°C/W
Typical 4-layer board with two
interconnecting vias
Typical 4-layer board
θ
JA
—
208
—
°C/W
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications:
Unless otherwise noted, V
IN
= 3.0V to 5.5V, F
OSC
= 1 MHz with 10% Duty Cycle, C
IN
= 0.1 μF,
V
IN
for typical values = 5.0V, T
A
= -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
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