參數(shù)資料
型號(hào): MCF5232CAB80
廠商: 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述: Integrated Microprocessor Hardware Specification
中文描述: 集成的微處理器,硬件規(guī)格
文件頁(yè)數(shù): 24/46頁(yè)
文件大?。?/td> 988K
代理商: MCF5232CAB80
MCF523x Integrated Microprocessor Hardware Specification, Rev. 2
Preliminary Electrical Characteristics
Freescale Semiconductor
24
7.2
Thermal Characteristics
The below table lists thermal resistance values.
Instantaneous Maximum Current
Single pin limit (applies to all pins)
3,4,5
I
D
25
mA
Operating Temperature Range (Packaged)
T
A
(T
L
- T
H
)
– 40 to 85
°
C
Storage Temperature Range
T
stg
– 65 to 150
°
C
1
Functional operating conditions are given in DC Electrical Specifications. Absolute Maximum
Ratings are stress ratings only, and functional operation at the maxima is not guaranteed.
Continued operation at these levels may affect device reliability or cause permanent damage
to the device.
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application of
any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g.,
either V
SS
or OV
DD
).
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages,
then use the larger of the two values.
All functional non-supply pins are internally clamped to V
SS
and OV
DD
.
Power supply must maintain regulation within operating OV
DD
range during instantaneous
and operating maximum current conditions. If positive injection current (V
in
> OV
DD
) is greater
than I
DD
, the injection current may flow out of OV
DD
and could result in external power supply
going out of regulation. Insure external OV
DD
load will shunt current greater than maximum
injection current. This will be the greatest risk when the processor is not consuming power
(ex; no clock).Power supply must maintain regulation within operating OV
DD
range during
instantaneous and operating maximum current conditions.
2
3
4
5
Table 8. Thermal Characteristics
Characteristic
Symbol
256
MAPBGA
196
MAPBGA
160
QFP
Unit
Junction to ambient, natural convection
Four layer board (2s2p)
θ
JMA
θ
JMA
θ
JB
θ
JC
Ψ
jt
26
1,2
1
θ
JMA
and
Ψ
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
θ
JmA
and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction
temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device
junction temperature specification can be verified by physical measurement in the customer’s system using the
Ψ
jt
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
2
32
1,2
40
1,2
°
C / W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
23
1,2
29
1,2
36
1,2
°
C / W
Junction to board
15
3
20
3
25
3
°
C / W
Junction to case
10
4
10
4
10
4
°
C / W
Junction to top of package
2
1,5
2
1,5
2
1,5
°
C / W
Maximum operating junction temperature
T
j
102
104
105
6
o
C
Table 7. Absolute Maximum Ratings
1,
2
(continued)
Rating
Symbol
Value
Unit
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