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參數(shù)資料
| 型號： | MCF52235 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | ColdFire Microcontroller |
| 中文描述： | ColdFire微控制器 |
| 文件頁數(shù)： | 31/50頁 |
| 文件大?。?/td> | 656K |
| 代理商： | MCF52235 |
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Preliminary Electrical Characteristics
MCF52235 ColdFire Microcontroller, Rev. 3
Freescale Semiconductor
31
The average chip-junction temperature (T
J
) in
°
C can be obtained from
Eqn. 1
where
T
A
= ambient temperature,
°
C
Θ
JMA
= package thermal resistance, junction-to-ambient,
°
C/W
P
D
= P
INT
+ P
I/O
P
INT
= chip internal power, I
DD
×
V
DD
, watts
P
I/O
= power dissipation on input and output pins — user determined
For most applications, PI/O < P
INT
and can be ignored. An approximate relationship between P
D
and T
J
(if P
I/O
is neglected) is:
Eqn. 2
Solving equations 1 and 2 for K gives:
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from
Equation 3
by measuring P
D
(at equilibrium)
for a known T
A
. Using this value of K, the values of P
D
and T
J
can be obtained by solving
Equation 1
and
Equation 2
iteratively
for any value of T
A
.
2.2
ESD Protection
Table 21. ESD Protection Characteristics
1,
2
1
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
Automotive Grade Integrated Circuits.
2
A device is defined as a failure if the device no longer meets the device specification
requirements after exposure to ESD pulses. Complete DC parametric and functional testing
is performed per applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
Characteristics
Symbol
Value
Units
ESD target for Human Body Model
ESD target for Machine Model
HBM circuit description
HBM
MM
R
series
C
R
series
C
2000
200
1500
100
0
200
V
V
ohms
pF
ohms
pF
—
MM circuit description
Number of pulses per pin (HBM)
positive pulses
negative pulses
Number of pulses per pin (MM)
positive pulses
negative pulses
Interval of pulses
—
—
1
1
—
—
—
3
3
1
—
sec
T
J
T
A
P
D
Θ
JMA
×
(
)
+
=
P
D
K
T
J
273
°
C
+
(
)
÷
=
K
P
D
T
A
273
°
C
+
(
)
Θ
JMA
P
D
2
×
+
×
=
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MCF5232CAB80 | Integrated Microprocessor Hardware Specification |
| MCF5232 | Integrated Microprocessor Hardware Specification |
| MCF5249 | CodeWarrior Development Studio for ColdFire㈢ Architectures |
| MCF5251_07 | ColdFire㈢ Microprocessor Data Sheet |
| MCF5251 | ColdFire Processor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCF52235_06 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microcontroller |
| MCF52235_07 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MCF52235_10 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MCF52235 ColdFire Microcontroller Data Sheet |
| MCF52235CAL60 | 功能描述:32位微控制器 - MCU KIRIN2E EPP RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風格:SMD/SMT |
| MCF52235CAL60A | 制造商:Freescale Semiconductor 功能描述:KIRIN2E EPP - REV A - Bulk |
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