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參數(shù)資料
| 型號(hào)： | MCF5207 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | Microprocessor Data Sheet |
| 中文描述： | 微處理器數(shù)據(jù)表 |
| 文件頁數(shù)： | 20/46頁 |
| 文件大小： | 936K |
| 代理商： | MCF5207 |
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MCF5208 ColdFire
Microprocessor Data Sheet, Rev. 0.5
Preliminary
Preliminary Electrical Characteristics
Freescale Semiconductor
20
The average chip-junction temperature (T
J
) in
°
C can be obtained from:
Eqn. 1
Where:
T
A
= Ambient Temperature,
°
C
Q
JMA
= Package Thermal Resistance, Junction-to-Ambient, ×C/W
P
D
= P
INT
+ P
I/O
P
INT
= I
DD
×
IV
DD
, Watts - Chip Internal Power
P
I/O
= Power Dissipation on Input and Output Pins — User Determined
For most applications P
I/O
< P
INT
and can be ignored. An approximate relationship between P
D
and T
J
(if
P
I/O
is neglected) is:
Eqn. 2
Solving equations 1 and 2 for K gives:
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from
Equation 3
by measuring
P
D
(at equilibrium) for a known T
A
. Using this value of K, the values of P
D
and T
J
can be obtained by
solving
Equation 1
and
Equation 2
iteratively for any value of T
A
.
5.3
ESD Protection
NOTES:
1
θ
JMA
and
Ψ
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
Freescale recommends the use of
θ
JmA
and power dissipation specifications in the system design to prevent
device junction temperatures from exceeding the rated specification. System designers should be aware that
device junction temperatures can be significantly influenced by board layout and surrounding devices.
Conformance to the device junction temperature specification can be verified by physical measurement in the
customer’s system using the
Ψ
jt
parameter, the device power dissipation, and the method described in
EIA/JESD Standard 51-2.
2
Per JEDEC JESD51-6 with the board horizontal.
3
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
4
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
5
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written in conformance with Psi-JT.
Table 6. ESD Protection Characteristics
1,
2
Characteristics
Symbol
Value
Units
ESD Target for Human Body Model
HBM
2000
V
T
J
T
A
P
D
Θ
JMA
×
(
)
+
=
P
D
273
°
C
T
J
+
)
-------------K
=
K
P
D
T
A
273
°
C
×
(
)
Q
JMA
P
D
2
×
+
×
=
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| MCF5207CAG166 | 功能描述:32位微控制器 - MCU MPC5207 MINIME 144 LQFP RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| MCF5207CVM166 | 功能描述:IC MCU 32BIT RISC 144-MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MCF520x 標(biāo)準(zhǔn)包裝:330 系列:- 核心處理器:- 芯體尺寸:8/16-位 速度:40MHz 連通性:UART/USART 外圍設(shè)備:DMA，PWM，WDT 輸入/輸出數(shù):32 程序存儲(chǔ)器容量:- 程序存儲(chǔ)器類型:外部程序存儲(chǔ)器 EEPROM 大小:- RAM 容量:- 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:100-BQFP 包裝:管件 |
| MCF5207CVM166 | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU PBGA-144 制造商:Freescale Semiconductor 功能描述:IC, 32BIT MPU, PBGA-144 |
| MCF5207CVM166J | 功能描述:32位微控制器 - MCU ColdFire Micro-Proc RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| MCF5208 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor |
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